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参数资料
| 型号： | TLV5510IPWR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | ADC |
| 英文描述： | 1-CH 8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDSO24 |
| 封装： | PLASTIC, TSSOP-24 |
| 文件页数： | 3/20页 |
| 文件大小： | 330K |
| 代理商： | TLV5510IPWR |
TLV5510
2.7-V TO 3.6-V 8-BIT HIGH-SPEED ANALOG-TO-DIGITAL CONVERTER
SLAS124C– DECEMBER 1997 – REVISED DECEMBER 1999
11
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
The following notes are design recommendations that should be used with the TLV5510.
D External analog and digital circuitry should be physically separated and shielded as much as possible to
reduce system noise.
D RF breadboarding or printed-circuit-board (PCB) techniques should be used throughout the evaluation and
production process. Breadboards should be copper clad for bench evaluation.
D Since AGND and DGND are connected internally, the ground lead in must be kept as noise free as possible.
A good method to use is twisted-pair cables for the supply lines to minimize noise pickup. An analog and
digital ground plane should be used on PCB layouts when additional logic devices are used. The AGND
and DGND terminals of the device should be tied to the analog ground plane.
D VDDA to AGND and VDDD to DGND should be decoupled with 1-F and 0.01-F capacitors, respectively,
placed as close as possible to the appropriate device terminals. A ceramic chip capacitor is recommended
for the 0.01-
F capacitor. Care should be exercised to assure a solid noise-free ground connection for the
analog and digital grounds.
D VDDA, AGND, and ANALOG IN terminals should be shielded from the higher frequency terminals, CLK and
D0–D7. If possible, AGND traces should be placed on both sides of the ANALOG IN traces on the PCB for
shielding.
D In testing or application of the device, the resistance of the driving source connected to the analog input
should be 10
or less within the analog frequency range of interest.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TLV5535 | 制造商:TI 制造商全称:Texas Instruments 功能描述:8-BIT, 35 MSPS, LOW-POWER ANALOG-TO-DIGITAL CONVERTER |
| TLV5535EVM | 功能描述:数据转换 IC 开发工具 TLV5535 Eval Mod RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
| TLV5535IPW | 功能描述:模数转换器 - ADC 8bit 35Msps 1ch 3.3V RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| TLV5535IPWG4 | 功能描述:模数转换器 - ADC 8 Bit 35 MSPS Single Ch. Low Pwr RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| TLV5535IPWR | 功能描述:模数转换器 - ADC 8 Bit 35 MSPS Single Ch. Low Pwr RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
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