- 您现在的位置：买卖IC网 > PDF目录11226 > TMS470R1A384PZ-T (Texas Instruments)IC RISC MCU 384K FLASH 100-LQFP PDF资料下载
参数资料
| 型号： | TMS470R1A384PZ-T |
| 厂商： | Texas Instruments |
| 文件页数： | 55/62页 |
| 文件大小： | 0K |
| 描述： | IC RISC MCU 384K FLASH 100-LQFP |
| 标准包装： | 90 |
| 系列： | TMS470 |
| 核心处理器： | ARM7 |
| 芯体尺寸： | 16/32-位 |
| 速度： | 48MHz |
| 连通性： | CAN，C2Slb，I²C，SCI，SPI |
| 外围设备： | DMA，PWM，WDT |
| 输入/输出数： | 53 |
| 程序存储器容量： | 384KB（384K x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 32K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 1.71 V ~ 2.05 V |
| 数据转换器： | A/D 12x10b |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 105°C |
| 封装/外壳： | 100-LQFP |
| 包装： | 托盘 |
| 产品目录页面： | 718 (CN2011-ZH PDF) |
| 配用： | 296-23003-ND - KIT DEV KICKSTART TMS470 |
| 其它名称： | 296-19292 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页当前第55页第56页第57页第58页第59页第60页第61页第62页
PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TMS470R1A384PGEQ
NRND
LQFP
PGE
144
60
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
TMS470R1A384PGET
NRND
LQFP
PGE
144
60
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
TMS470R1A384PZ-T
NRND
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
TMS470R1A384PZQ
NRND
LQFP
PZ
100
TBD
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
相关PDF资料 |
PDF描述 |
|---|---|
| TMS320F28069PFPS | IC MCU 32BIT 256KB FLASH 80HTQFP |
| 2220PC684MAT1A | CAP CER 0.68UF 250V 20% X7R 2220 |
| 2220PC105MAT9A | CAP CER 1UF 250V X7R 20% 2220 |
| LTC1393CS | IC MULTIPLEXER DUAL 4X1 16SOIC |
| 2220PC105MAT1A | CAP CER 1UF 250V X7R 20% 2220 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TMS470R1A384PZ-TR | 制造商:Texas Instruments 功能描述:48MHZ / 384K FLASH - Tape and Reel |
| TMS470R1A64 | 制造商:TI 制造商全称:Texas Instruments 功能描述:16/32-Bit RISC Flash Microcontroller |
| TMS470R1A64PNT | 功能描述:ARM微控制器 - MCU 48mhz / 64k Flash RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 处理器系列:STM32F373xx 数据总线宽度:32 bit 最大时钟频率:72 MHz 程序存储器大小:256 KB 数据 RAM 大小:32 KB 片上 ADC:Yes 工作电源电压:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作温度范围:- 40 C to + 85 C 封装 / 箱体:LQFP-48 安装风格:SMD/SMT |
| TMS470R1B1M | 制造商:TI 制造商全称:Texas Instruments 功能描述:16/32-Bit RISC Flash Microcontroller |
| TMS470R1B1M_12 | 制造商:TI 制造商全称:Texas Instruments 功能描述:16/32-Bit RISC Flash Microcontroller |
发布紧急采购，3分钟左右您将得到回复。