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参数资料
| 型号： | TOP256GN-TL |
| 厂商： | Power Integrations |
| 文件页数： | 27/50页 |
| 文件大小： | 0K |
| 描述： | IC OFFLINE SWIT PROG OVP 8SMD |
| 产品培训模块： | TOPSwitch® HX General Introduction |
| 标准包装： | 1 |
| 系列： | TOPSwitch®-HX |
| 输出隔离： | 隔离 |
| 频率范围： | 119kHz ~ 145kHz |
| 输出电压： | 700V |
| 功率（瓦特）： | 63W |
| 工作温度： | -40°C ~ 150°C |
| 封装/外壳： | 8-SMD（7 个接脚），鸥形翼 |
| 供应商设备封装： | SMD-8C |
| 包装： | 标准包装 |
| 配用： | 596-1193-ND - KIT REF DESIGN TOP HX FOR TOP258 |
| 其它名称： | 596-1182-6 |
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TOP252-262
80
70
60
50
40
30
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-10
0
Primary Side Connections
Use a single point (Kelvin) connection at the negative terminal of
the input filter capacitor for the TOPSwitch-HX SOURCE pin
and bias winding return. This improves surge capabilities by
returning surge currents from the bias winding directly to the
input filter capacitor. The CONTROL pin bypass capacitor
should be located as close as possible to the SOURCE and
CONTROL pins, and its SOURCE connection trace should not
be shared by the main MOSFET switching currents. All
SOURCE pin referenced components connected to the
MULTI-FUNCTION (M-pin), VOLTAGE MONITOR (V-pin) or
EXTERNAL CURRENT LIMIT (X-pin) pins should also be located
-10
-20
0.15
1
EN55022B (QP)
EN55022B (AV)
10
30
closely between their respective pin and SOURCE. Once again,
the SOURCE connection trace of these components should not
be shared by the main MOSFET switching currents. It is very
critical that SOURCE pin switching currents are returned to the
Frequency (MHz)
Figure 45a. Fixed Frequency Operation Without Jitter.
input capacitor negative terminal through a separate trace that
is not shared by the components connected to CONTROL,
MULTI-FUNCTION, VOLTAGE MONITOR or EXTERNAL
80
70
60
50
40
30
20
TOPSwitch-HX (with jitter)
CURRENT LIMIT pins. This is because the SOURCE pin is also
the controller ground reference pin. Any traces to the M, V, X or
C pins should be kept as short as possible and away from the
DRAIN trace to prevent noise coupling. VOLTAGE MONITOR
resistors (R1 and R2 in Figures 46, 47, 48, R3 and R4 in
Figure 49, and R14 in Figure 50) should be located close to the
M or V pin to minimize the trace length on the M or V pin side.
Resistors connected to the M, V or X pin should be connected
as close to the bulk cap positive terminal as possible while
routing these connections away from the power switching
-10
0
-10
-20
0.15
1
EN55022B (QP)
EN55022B (AV)
10
30
circuitry. In addition to the 47 μF CONTROL pin capacitor, a
high frequency bypass capacitor in parallel may be used for
better noise immunity. The feedback optocoupler output
should also be located close to the CONTROL and SOURCE
pins of TOPSwitch-HX and away from the drain and clamp
component traces.
Frequency (MHz)
Figure 45b. TOPSwitch-HX Full Range EMI Scan (132 kHz With Jitter) With
Identical Circuitry and Conditions.
Standby Consumption
Frequency reduction can significantly reduce power loss at light
or no load, especially when a Zener clamp is used. For very low
secondary power consumption, use a TL431 regulator for
feedback control. A typical TOPSwitch-HX circuit automatically
enters MCM mode at no load and the low frequency mode at
light load, which results in extremely low losses under no-load
or standby conditions.
High Power Designs
The TOPSwitch-HX family contains parts that can deliver up to
333 W. High power designs need special considerations.
Guidance for high power designs can be found in the Design
Guide for TOPSwitch-HX (AN-43).
TOPSwitch-HX Layout Considerations
The TOPSwitch-HX has multiple pins and may operate at
Y Capacitor
The Y capacitor should be connected close to the secondary
output return pin(s) and the positive primary DC input pin of the
transformer.
Heat Sinking
The tab of the Y package (TO-220C) and E package (eSIP-7C)
and L package (eSIP-7F) are internally electrically tied to the
SOURCE pin. To avoid circulating currents, a heat sink
attached to the tab should not be electrically tied to any primary
ground/source nodes on the PC board. When using a P (DIP-8),
G (SMD-8) or M (DIP-10) package, a copper area underneath
the package connected to the SOURCE pins will act as an
effective heat sink. On double sided boards, topside and bottom
side areas connected with vias can be used to increase the
effective heat sinking area. In addition, sufficient copper area
should be provided at the anode and cathode leads of the
output diode(s) for heat sinking. In Figures 46 to 50 a narrow
trace is shown between the output rectifier and output filter
capacitor. This trace acts as a thermal relief between the rectifier
and filter capacitor to prevent excessive heating of the capacitor.
high power levels. The following guidelines should be
carefully followed.
27
www.powerint.com
Rev. H 06/13
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| TOP256LG | 功能描述:交流/直流开关转换器 64W (85-264VAC) 88W (230V AC) RoHS:否 制造商:STMicroelectronics 输出电压:800 V 输入/电源电压（最大值）:23.5 V 输入/电源电压（最小值）:11.5 V 开关频率:115 kHz 电源电流:1.6 mA 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SSO-10 封装:Reel |
| TOP256LN | 功能描述:交流/直流开关转换器 64W (85-264VAC) 88W (230V AC) RoHS:否 制造商:STMicroelectronics 输出电压:800 V 输入/电源电压（最大值）:23.5 V 输入/电源电压（最小值）:11.5 V 开关频率:115 kHz 电源电流:1.6 mA 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SSO-10 封装:Reel |
| TOP256MG | 功能描述:交流/直流开关转换器 26W/40W PK 85-264VAC 34W/63W PK (230V AC) RoHS:否 制造商:STMicroelectronics 输出电压:800 V 输入/电源电压（最大值）:23.5 V 输入/电源电压（最小值）:11.5 V 开关频率:115 kHz 电源电流:1.6 mA 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SSO-10 封装:Reel |
| TOP256MN | 功能描述:交流/直流开关转换器 Off-Line Switcher IC 26W/64W PK RoHS:否 制造商:STMicroelectronics 输出电压:800 V 输入/电源电压（最大值）:23.5 V 输入/电源电压（最小值）:11.5 V 开关频率:115 kHz 电源电流:1.6 mA 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SSO-10 封装:Reel |
| TOP256PG | 功能描述:交流/直流开关转换器 26W/40W PK 85-264VAC 34W/63W PK (230V AC) RoHS:否 制造商:STMicroelectronics 输出电压:800 V 输入/电源电压（最大值）:23.5 V 输入/电源电压（最小值）:11.5 V 开关频率:115 kHz 电源电流:1.6 mA 工作温度范围:- 40 C to + 150 C 安装风格:SMD/SMT 封装 / 箱体:SSO-10 封装:Reel |
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