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参数资料
| 型号： | TPA0242PWPG4 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 音频控制 |
| 英文描述： | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO24 |
| 封装： | GREEN, PLASTIC, HTSSOP-24 |
| 文件页数： | 7/35页 |
| 文件大小： | 806K |
| 代理商： | TPA0242PWPG4 |
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THERMAL INFORMATION
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
TPA0242
SLOS287C – NOVEMBER 1999 – REVISED SEPTEMBER 2004
The thermally-enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad (see
Figure 30) to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down
TO-220-type packages have leads formed as gull wings to make them applicable for surface-mount applications.
However, These packages have two shortcomings: they do not address the very low-profile requirements (<2
mm) of many of today's advanced systems, and they do not offer a high-enough terminal count to accommodate
increasing integration. On the other hand, traditional low-power surface-mount packages require power
dissipation derating that severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with
thermal performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size
and limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction
paths that remove heat from the component. The thermal pad is formed using a patented lead-frame design and
manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered or
otherwise thermally coupled to an external heat dissipator, high power dissipation in the ultrathin, fine-pitch,
surface-mount package can be reliably achieved.
Figure 30. Views of Thermally Enhanced PWP Package
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| TPA0243DGQRG4 | 2 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO10 |
| TPA0252PWPR | 2 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO24 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TPA0242PWPR | 功能描述:音频放大器 St 2W Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TPA0242PWPRG4 | 功能描述:音频放大器 St 2W Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TPA0243 | 制造商:TI 制造商全称:Texas Instruments 功能描述:2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE |
| TPA0243DGQ | 功能描述:音频放大器 2W Mono Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
| TPA0243DGQG4 | 功能描述:音频放大器 2W Mono Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 产品:General Purpose Audio Amplifiers 输出类型:Digital 输出功率: THD + 噪声: 工作电源电压:3.3 V 电源电流: 最大功率耗散: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:TQFP-64 封装:Reel |
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