参数资料
| 型号： | TPABASEKITEVM |
| 厂商： | Texas Instruments |
| 文件页数： | 20/32页 |
| 文件大小： | 0K |
| 描述： | EVAL MODULE AUDIO AMP PLATFORM |
| 标准包装： | 1 |
| 主要目的： | 音频，音频处理 |
| 嵌入式： | 否 |
| 已用 IC / 零件： | TI's Audio EVM Boards |
| 主要属性： | 即插即用立体声设备的插口 / 单声道功率放大器 EVM 板 |
| 次要属性： | 还可测试输入信号调节 EVM 板，以及耳机放大器 EVM 板 |
| 已供物品： | 板 |
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Configuration
4) Carefully align the pins of the module with the socket pin receptacles
5) Gently press the module into place
6) Check to be sure that all pins are seated properly and that none are bent
over
3.2.2.2
EVM Removal
1) Remove all power from the evaluation platform
2) Using an appropriate tool as a lever, gently pry up one side of the module
a small amount
3) Change to the opposite side of the module and use the tool to pry that side
up a small amount
4) Alternate between sides, prying the module up a little more each time to
avoid bending the pins, until it comes loose from the socket
5) Lift the EVM off of the platform
3.2.3
Signal Routing
The audio signal from the input jacks can be applied to the signal conditioning
socket (U1) if a signal conditioning EVM is installed, or socket U1 can be
bypassed and the audio input signal applied directly to the inputs of the
installed power amplifiers. Switch S2 selects signal conditioning or bypasses
it (Figure 3–2).
Figure 3–2. Signal Routing Switches
U2
+
Stereo Power
R
R
Amplifier
or
U4 and/or U3
–
–
J7, J8, J9
Speaker
Outputs
Mono Power
L
L
R
Off
Amplifier(s)
U2 – U4
R
+
J3, J4, J5
Audio
Input
U1
Signal
Conditioning
S2
U5
Stereo
Headphone
Amplifier
R
L
S3
GND
+
–
–
J10
Headphone
Output
L
On
+
L
U5
Switch S3 is the source select for the stereo headphone output jack, J10. The
headphone jack is capacitively coupled and can output either the signal from
the headphone amplifier in socket U5, or the output signal from the power
amplifier(s) installed in socket U2 or U3 and/or U4, as determined by the
setting of S3.
3-4
Details
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