INTERNAL REGULATORS
TPS40077 POWER DISSIPATION
P
T +
2
P
D
V
DR
) IQ
V
IN
(Watts)
(14)
P
T + 2
Qg
f
SW ) IQ
V
IN
(Watts)
(15)
P
T +
T
J * TA
qJA
(Watts)
(16)
www.ti.com ..................................................................................................................................................... SLUS714D – JANUARY 2007 – REVISED APRIL 2009
The internal regulators are linear regulators that provide controlled voltages from which the drivers and the
internal circuitry operate. The DBP pin is connected to a nominal 8-V regulator that provides power for the driver
circuits. This regulator has two modes of operation. At VDD voltages below 8.5 V, the regulator is in a low-dropout
mode of operation and tries to provide as little impedance as possible from VDD to DBP. Above 10 V at VDD, the
regulator regulates DBP to 8 V. Between these two voltages, the regulator remains in the state it was in when
VDD entered this region (see Figure 20). Small amounts of current can be drawn from this pin for other circuit functions, as long as power dissipation in the controller device remains at acceptable levels and junction
temperature does not exceed 125°C.
The LVBP pin is connected to another internal regulator that provides 4.2 V (nom) for the operation of
low-voltage circuitry in the controller. This pin can be used for other circuit purposes, but extreme care must be
taken to ensure that no extra noise is coupled onto this pin; otherwise, controller performance suffers. Current
draw is not to exceed 1 mA. See
Figure 21 for typical output voltage at this pin.
The power dissipation in the TPS40077 is largely dependent on the MOSFET driver currents and the input
voltage. The driver current is proportional to the total gate charge, Qg, of the external MOSFETs. Driver power
(neglecting external gate resistance) can be calculated from:
PD = Qg × VDR × fSW
(Watts/driver)
where VDR is the driver output voltage
The total power dissipation in the TPS40077, assuming the same MOSFET is selected for both the high-side and
or
where IQ is the quiescent operating current (neglecting drivers)
The maximum power capability of the TPS40077 PowerPAD package is dependent on the layout as well as air
flow. The thermal impedance from junction to air, assuming 2-oz. copper trace and thermal pad with solder and
no air flow, is 37°C/W. See the application report titled PowerPAD Thermally Enhanced Package
(SLMA002) for
detailed information on PowerPAD package mounting and usage.
The maximum allowable package power dissipation is related to ambient temperature by
Equation 16. For
θ
JA,
Copyright 2007–2009, Texas Instruments Incorporated
21