SLVS871B – FEBRUARY 2010 – REVISED SEPTEMBER 2010
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
PACKAGE
PART
OUTPUT
DEVICE
TA
PACKAGE
ORDERING(2) (3)
MARKING
NUMBER
VOLTAGE
SPECIFIC FEATURE
CHIP CODE
TPS62660
1.8V
TPS62660YFF
OO
TPS62661(4)
1.8V
Fast start-up time
-40°C to 85°C
YFF-6
Output capacitor
TPS62665
1.2V
TPS62665YFF
RS
discharge
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
(2)
The YFF package is available in tape and reel. Add an R suffix (TPS62660YFFR) to order quantities of 3000 parts. Add a T suffix
(TPS62660YFFT) to order quantities of 250 parts.
(3)
Internal tap points are available to facilitate output voltages in 25mV increments.
(4)
Product preview.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
Voltage at VIN, SW(2)
–0.3 V to 7 V
VI
Voltage at FB(2)
–0.3 V to 3.6 V
Voltage at EN, MODE (2)
–0.3 V to VI + 0.3 V
IO
Peak output current
1000 mA
Power dissipation
Internally limited
TA
Operating temperature range(3)
–40°C to 85°C
TJ (max)
Maximum operating junction temperature
150°C
Tstg
Storage temperature range
–65°C to 150°C
Human body model
2 kV
ESD rating (4) Charge device model
1 kV
Machine model
200 V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to network ground terminal.
(3)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (qJA), as given by the following equation: TA(max)= TJ(max)–(qJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum junction temperature of 105°C.
(4)
The human body model is a 100-pF capacitor discharged through a 1.5-k
resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
DISSIPATION RATINGS
(1)
POWER RATING
DERATING FACTOR
PACKAGE
RqJA
(2)
RqJB
(2)
TA ≤ 25°C
ABOVE TA = 25°C
YFF-6
125°C/W
53°C/W
800mW
8mW/°C
(1)
Maximum power dissipation is a function of TJ(max), qJA and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = [TJ(max)-TA] / qJA.
(2)
This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).
2
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