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| 型号： | TPS62660YFFR |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 稳压器 |
| 英文描述： | 1.75 A SWITCHING REGULATOR, 6600 kHz SWITCHING FREQ-MAX, BGA6 |
| 封装： | GREEN, DSBGA-6 |
| 文件页数： | 15/30页 |
| 文件大小： | 791K |
| 代理商： | TPS62660YFFR |
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J(MAX)
A
D(MA)
θJA
T
105°C
85°C
P
=
= 160 mW
R
125°C/W
-
YMSCC
LLLL
A1
B1
C1
A2
B2
D
E
C2
SLVS871B – FEBRUARY 2010 – REVISED SEPTEMBER 2010
www.ti.com
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added
heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the
power-dissipation limits of a given component
Three basic approaches for enhancing thermal performance are listed below:
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
The maximum recommended junction temperature (TJ) of the TPS6266x devices is 105°C. The thermal
resistance of the 6-pin CSP package (YFF-6) is RqJA = 125°C/W. Regulator operation is specified to a maximum
ambient temperature TA of 85°C. Therefore, the maximum steady state power dissipation is about 160 mW.
(2)
PACKAGE SUMMARY
CHIP SCALE PACKAGE
(BOTTOM VIEW)
(TOP VIEW)
Code:
YM — Year Month date Code
S — Assembly site code
CC— Chip code
LLLL — Lot trace code
CHIP SCALE PACKAGE DIMENSIONS
The TPS6266x device is available in an 6-bump chip scale package (YFF, NanoFree). The package
dimensions are given as:
D = 1.30 ±0.03 mm
E = 0.926 ±0.03 mm
22
Copyright 2010, Texas Instruments Incorporated
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