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| 型号： | TPS63031DSKT |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 稳压器 |
| 英文描述： | 1.1 A SWITCHING REGULATOR, 2600 kHz SWITCHING FREQ-MAX, PDSO10 |
| 封装： | 2.50 X 2.50 MM, PLASTIC, SON-10 |
| 文件页数： | 8/24页 |
| 文件大小： | 1326K |
| 代理商： | TPS63031DSKT |
LAYOUT CONSIDERATIONS
THERMAL INFORMATION
SLVS696A – OCTOBER 2008 – REVISED MARCH 2009.................................................................................................................................................. www.ti.com
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.
Use a common ground node for power ground and a different one for control ground to minimize the effects of
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
control ground, it is recommended to use short traces as well, separated from the power ground traces. This
avoids ground shift problems, which can occur due to superimposition of power ground current and control
ground current.
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
Improving the power dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB by soldering the PowerPAD
Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal
Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).
16
Copyright 2008–2009, Texas Instruments Incorporated
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