参数资料
| 型号： | TPS75315QPWPREP |
| 厂商： | Texas Instruments |
| 文件页数： | 24/33页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 1.5V 1.5A 20HTSSOP |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 1.5V |
| 输入电压： | 2.7 V ~ 5 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1.5A（最小值） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽）裸露焊盘 |
| 供应商设备封装： | 20-HTSSOP |
| 包装： | 标准包装 |
| 其它名称： | 296-22506-6 |
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TPS75101 EP, '75115 EP, '75118 EP, '75125 EP, '75133 EP WITH POWER GOOD
TPS75301 EP, TPS75315 EP, TPS75318 EP, TPS75325 EP, TPS75333 EP WITH RESET
FAST TRANSIENT RESPONSE 1.5 A LOW DROPOUT VOLTAGE REGULATORS
SGLS158 ? APRIL 2003
THERMAL INFORMATION
thermally enhanced TSSOP-20 (PWP ? PowerPad ? ) (continued)
Figure 28 is an example of a thermally enhanced PWB layout for use with the new PWP package. This board
configuration was used in the thermal experiments that generated the power ratings shown in Figure 26 and Figure
27. As discussed earlier, copper has been added on the PWB to conduct heat away from the device. R θ JA for this
assembly is illustrated in Figure 26 as a function of heat-sink area. A family of curves is included to illustrate the effect
of airflow introduced into the system.
Heat-Sink Area
1 oz Copper
Board thickness
Board size
Board material
Copper trace/heat sink
Exposed pad mounting
62 mils
3.2 in. × 3.2 in.
FR4
1 oz
63/67 tin/lead solder
Figure 28. PWB Layout (Including Copper Heatsink Area) for Thermally Enhanced PWP Package
From Figure 26, R θ JA for a PWB assembly can be determined and used to calculate the maximum power-dissipation
limit for the component/PWB assembly, with the equation:
T max * T
q JA(system)
P
D(max)
+
R
J A
(5)
Where:
T J max is the maximum specified junction temperature (150 ° C absolute maximum limit, 125 ° C recommended
operating limit) and T A is the ambient temperature.
P D(max) should then be applied to the internal power dissipated by the TPS75133QPWP regulator. The equation
for calculating total internal power dissipation of the TPS75133QPWP is:
+ V * V
P
D(total)
I
O
I
O
) V
I
I
Q
(6)
Since the quiescent current of the TPS75133QPWP is very low, the second term is negligible, further simplifying
the equation to:
+ V * V
P
D(total)
I
O
I
O
(7)
For the case where T A = 55 ° C, airflow = 200 ft/min, copper heat-sink area = 4 cm 2 , the maximum power-dissipation
limit can be calculated. First, from Figure 26, we find the system R θ JA is 50 ° C/W; therefore, the maximum
power-dissipation limit is:
° °
A + 125 C * 55 C + 1.4 W
T max * T
q JA(system)
24
P
D(max)
+
J
°
R 50 C W
POST OFFICE BOX 655303
? DALLAS, TEXAS 75265
(8)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TPS75315QPWPRG4 | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75315QPWPRQ1 | 功能描述:低压差稳压器 - LDO Fast-Trans-Resp 1.5A LDO Vltg Reg RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75318QPWP | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75318QPWPG4 | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75318QPWPR | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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