参数资料
| 型号： | TPS75315QPWPREP |
| 厂商： | Texas Instruments |
| 文件页数： | 25/33页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 1.5V 1.5A 20HTSSOP |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 1.5V |
| 输入电压： | 2.7 V ~ 5 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1.5A（最小值） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-TSSOP（0.173"，4.40mm 宽）裸露焊盘 |
| 供应商设备封装： | 20-HTSSOP |
| 包装： | 标准包装 |
| 其它名称： | 296-22506-6 |
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TPS75101 EP, '75115 EP, '75118 EP, '75125 EP, '75133 EP WITH POWER GOOD
TPS75301 EP, TPS75315 EP, TPS75318 EP, TPS75325 EP, TPS75333 EP WITH RESET
FAST TRANSIENT RESPONSE 1.5 A LOW DROPOUT VOLTAGE REGULATORS
SGLS158 ? APRIL 2003
THERMAL INFORMATION
thermally enhanced TSSOP-20 (PWP ? PowerPad ? ) (continued)
If the system implements a TPS75133QPWP regulator, where V I = 5 V and I O = 800 mA, the internal power
dissipation is:
+ V * V
P
D(total)
I
O
I
O
+ (5 * 3.3)
0.8 + 1.36 W
(9)
Comparing P D(total) with P D(max) reveals that the power dissipation in this example does not exceed the calculated
limit. When it does, one of two corrective actions should be made: raising the power-dissipation limit by increasing
the airflow or the heat-sink area, or lowering the internal power dissipation of the regulator by reducing the input
voltage or the load current. In either case, the above calculations should be repeated with the new system
parameters.
mounting information
The primary requirement is to complete the thermal contact between the thermal pad and the PWB metal. The
thermal pad is a solderable surface and is fully intended to be soldered at the time the component is mounted.
Although voiding in the thermal-pad solder-connection is not desirable, up to 50% voiding is acceptable. The data
included in Figures 26 and 27 is for soldered connections with voiding between 20% and 50%. The thermal analysis
shows no significant difference resulting from the variation in voiding percentage.
Figure 29 shows the solder-mask land pattern for the
PWP package. The minimum recommended heat-
sink area is also illustrated. This is simply a copper
plane under the body extent of the package, including
Minimum Recommended
Heat-Sink Area
Location of Exposed
Thermal Pad on
PWP Package
metal routed under terminals 1, 10, 11, and 20.
Figure 29. PWP Package Land Pattern
POST OFFICE BOX 655303
? DALLAS, TEXAS 75265
25
相关PDF资料 |
PDF描述 |
|---|---|
| TPS75301QPWPREP | IC REG LDO ADJ 1.5A 20HTSSOP |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TPS75315QPWPRG4 | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75315QPWPRQ1 | 功能描述:低压差稳压器 - LDO Fast-Trans-Resp 1.5A LDO Vltg Reg RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75318QPWP | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75318QPWPG4 | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS75318QPWPR | 功能描述:低压差稳压器 - LDO Fast-Tran-Resp 1.5-A RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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