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| 型号： | TPS780330220DRVTG4 |
| 厂商： | Texas Instruments |
| 文件页数： | 21/33页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.3V/2.2V .15A 6-SON |
| 标准包装： | 250 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.3V，2.2V |
| 输入电压： | 2.2 V ~ 5.5 V |
| 稳压器数量： | 1 |
| 电流 - 输出： | 150mA（最小值） |
| 电流 - 限制（最小）： | 150mA |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-WDFN 裸露焊盘 |
| 供应商设备封装： | 6-SON 裸露焊盘（2x2） |
| 包装： | 带卷 (TR) |
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TI Information — Selective Disclosure
TPS780 Series
SBVS083D – JANUARY 2007 – REVISED SEPTEMBER 2012
THERMAL INFORMATION
THERMAL PROTECTION
Thermal protection disables the output when the
junction temperature rises to approximately +160°C,
The internal protection circuitry of the TPS780 series
has been designed to protect against overload
conditions. However, it is not intended to replace
proper heatsinking. Continuously running the TPS780
allowing the device to cool. Once the junction
series
into
thermal
shutdown
degrades
device
temperature cools to approximately +140°C, the
output circuitry is enabled. Depending on power
reliability.
dissipation,
thermal
resistance,
and
ambient
POWER DISSIPATION
temperature, the thermal protection circuit may cycle
on and off again. This cycling limits the dissipation of
the regulator, protecting it from damage as a result of
overheating.
Any tendency to activate the thermal protection circuit
The ability to remove heat from the die is different for
each package type, presenting different
considerations in the PCB layout. The PCB area
around the device that is free of other components
moves the heat from the device to the ambient air.
indicates
excessive
power
dissipation
or
an
Performance data for JEDEC low- and high-K boards
inadequate heatsink. For reliable operation, junction
are given in the Dissipation Ratings table. Using
temperature should be limited to +125°C maximum.
heavier
copper
increases
the
effectiveness
in
To estimate the margin of safety in a complete design
removing heat from the device. The addition of plated
(including
heatsink),
increase
the
ambient
through-holes
to
heat-dissipating
layers
also
temperature until the thermal protection is triggered;
improves
the
heatsink
effectiveness.
Power
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
dissipation depends on input voltage and load
conditions. Power dissipation (P D ) is equal to the
+35°C
above
the
maximum
expected
ambient
product of the output current times the voltage drop
condition
of
your
particular
application.
This
across the output pass element (V IN to V OUT ), as
configuration
produces
a
worst-case
junction
temperature of +125°C at the highest expected
ambient temperature and worst-case load.
P D = (V IN - V OUT ) ′ I OUT
PACKAGE MOUNTING
(4)
Solder
pad
footprint
recommendations
for
the
TPS780
series
are
available
from
the
Texas
Instruments web site at www.ti.com through the
Copyright ? 2007–2012, Texas Instruments Incorporated
21
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| TPS78101DDCT | 功能描述:低压差稳压器 - LDO Sgl Output LDO 150mA Adj. RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| TPS78101DDCTG4 | 功能描述:低压差稳压器 - LDO Sgl Output LDO 150mA Adj RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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