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参数资料
| 型号： | TPS82673SIPT |
| 厂商： | Texas Instruments |
| 文件页数： | 21/30页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC 1.26V .6A 8USIP |
| 标准包装： | 1 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 1.26V |
| 输入电压： | 2.3 V ~ 4.8 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 5.45MHz |
| 电流 - 输出： | 600mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-VFBGA |
| 包装： | 标准包装 |
| 供应商设备封装： | 8-uSIP |
| 其它名称： | 296-30408-6 |
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SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
LAYOUT CONSIDERATION
In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 43 shows the appropriate diameters for a MicroSiP TM
layout.
Copper Trace Width
Solder Pad Width
Solder Mask Opening
Solder Mask Thickness
Copper Trace Thickness
M0200-01
Figure 43. Recommended Land Pattern Image and Dimensions
SOLDER PAD
DEFINITIONS (1) (2) (3) (4)
Non-solder-mask
defined (NSMD)
COPPER PAD
0.30mm
SOLDER MASK
OPENING
0.360mm
(5)
COPPER
THICKNESS
1oz max (0.032mm)
STENCIL (6)
OPENING
0.34mm diameter
STENCIL THICKNESS
0.1mm thick
(1)
(2)
(3)
(4)
(5)
(6)
Circuit traces from non-solder-mask defined PWB lands should be 75 μ m to 100 μ m wide in the exposed area inside the solder mask
opening. Wider trace widths reduce device stand off and affect reliability.
Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
Recommend solder paste is Type 3 or Type 4.
For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue
performance.
Solder mask thickness should be less than 20 μ m on top of the copper circuit pattern.
For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste
volume control.
SURFACE MOUNT INFORMATION
The TPS8267x MicroSiP? DC/DC converter uses an open frame construction that is designed for a fully
automated assembly process and that features a large surface area for pick and place operations. See the "Pick
Area" in the package drawings.
Package height and weight have been kept to a minimum thereby to allow the MicroSiP? device to be handled
similarly to a 0805 component.
See JEDEC/IPC standard J-STD-20b for reflow recommendations.
Copyright ? 2010–2012, Texas Instruments Incorporated
21
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TPS82674 | 制造商:TI 制造商全称:Texas Instruments 功能描述:600-mA, HIGH-EFFICIENCY MicroSiP? STEP-DOWN CONVERTER (PROFILE <1.0mm) |
| TPS826745 | 制造商:TI 制造商全称:Texas Instruments 功能描述:600-mA, HIGH-EFFICIENCY MicroSiP STEP-DOWN CONVERTER (PROFILE <1.0mm) |
| TPS826745SIPR | 制造商:Texas Instruments 功能描述:IC REG BUCK 1.225V .6A 8USIP 制造商:Texas Instruments 功能描述:600mA Fully Int,Low Noise SD Converter |
| TPS826745SIPT | 制造商:Texas Instruments 功能描述:600mA Fully Int,Low Noise SD Converter |
| TPS82674SIP | 制造商:TI 制造商全称:Texas Instruments 功能描述:600-mA, HIGH-EFFICIENCY MicroSiP? STEP-DOWN CONVERTER (PROFILE <1.0mm) |
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