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参数资料
| 型号： | TPS82673SIPT |
| 厂商： | Texas Instruments |
| 文件页数： | 22/30页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC 1.26V .6A 8USIP |
| 标准包装： | 1 |
| 类型： | 降压（降压） |
| 输出类型： | 固定 |
| 输出数： | 1 |
| 输出电压： | 1.26V |
| 输入电压： | 2.3 V ~ 4.8 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 5.45MHz |
| 电流 - 输出： | 600mA |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-VFBGA |
| 包装： | 标准包装 |
| 供应商设备封装： | 8-uSIP |
| 其它名称： | 296-30408-6 |
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SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
THERMAL INFORMATION
The die temperature of the TPS8267x must be lower than the maximum rating of 125°C, so care should be taken
in the layout of the circuit to ensure good heat sinking of the TPS8267x.
To estimate the junction temperature, approximate the power dissipation within the TPS8267x by applying the
typical efficiency stated in this datasheet to the desired output power; or, by taking a power measurement if you
have an actual TPS8267x device and TPS82671EVM evaluation module. Then calculate the internal temperature
rise of the TPS8267x above the surface of the printed circuit board by multiplying the TPS8267x power
dissipation by the thermal resistance.
The actual thermal resistance of the TPS8267x to the printed circuit board depends on the layout of the circuit
board, but the thermal resistance given in the Thermal Information Table can be used as a guide.
Three basic approaches for enhancing thermal performance are listed below:
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Improve the power dissipation capability of the PCB design.
Improve the thermal coupling of the component to the PCB.
Introduce airflow into the system.
PACKAGE SUMMARY
SIP PACKAGE
TOP VIEW
BOTTOM VIEW
A1
CC
YML
LSB
D
C1
B1
A1
C2
B2
A2
C3
A3
E
Code:
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?
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CC — Customer Code (device/voltage specific)
YML — Y: Year, M: Month, L: Lot trace code
LSB — L: Lot trace code, S: Site code, B: Board locator
MicroSiP TM DC/DC MODULE PACKAGE DIMENSIONS
The TPS8267x device is available in an 8-bump ball grid array (BGA) package. The package dimensions are:
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D = 2.30 ±0.05 mm
E = 2.90 ±0.05 mm
REFERENCES
"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE
TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by
Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago.
22
Copyright ? 2010–2012, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TPS82674 | 制造商:TI 制造商全称:Texas Instruments 功能描述:600-mA, HIGH-EFFICIENCY MicroSiP? STEP-DOWN CONVERTER (PROFILE <1.0mm) |
| TPS826745 | 制造商:TI 制造商全称:Texas Instruments 功能描述:600-mA, HIGH-EFFICIENCY MicroSiP STEP-DOWN CONVERTER (PROFILE <1.0mm) |
| TPS826745SIPR | 制造商:Texas Instruments 功能描述:IC REG BUCK 1.225V .6A 8USIP 制造商:Texas Instruments 功能描述:600mA Fully Int,Low Noise SD Converter |
| TPS826745SIPT | 制造商:Texas Instruments 功能描述:600mA Fully Int,Low Noise SD Converter |
| TPS82674SIP | 制造商:TI 制造商全称:Texas Instruments 功能描述:600-mA, HIGH-EFFICIENCY MicroSiP? STEP-DOWN CONVERTER (PROFILE <1.0mm) |
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