参数资料
型号: TPS82673SIPT
厂商: Texas Instruments
文件页数: 3/30页
文件大小: 0K
描述: IC REG BUCK SYNC 1.26V .6A 8USIP
标准包装: 1
类型: 降压(降压)
输出类型: 固定
输出数: 1
输出电压: 1.26V
输入电压: 2.3 V ~ 4.8 V
PWM 型: 电压模式
频率 - 开关: 5.45MHz
电流 - 输出: 600mA
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-VFBGA
包装: 标准包装
供应商设备封装: 8-uSIP
其它名称: 296-30408-6

TPS82670, TPS82671, TPS82672, TPS82673, TPS82674
TPS82675, TPS82676, TPS82677, TPS826711, TPS826745, TPS826765
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
SLVSAI0F – OCTOBER 2010 – REVISED NOVEMBER 2012
VALUE
MIN
MAX
UNIT
Voltage at VIN (2) (3)
–0.3
6
V
V I
Voltage at VOUT (3)
–0.3
3.6
V
Voltage at EN, MODE
(3)
–0.3
V IN + 0.3
V
Power dissipation
Internally limited
T A
T INT (max)
T stg
Operating temperature range (4)
Maximum internal operating temperature
Storage temperature range
Human body model
–40
–55
85
125
125
2
°C
°C
°C
kV
ESD rating
(5)
Charge device model
Machine model
1
200
kV
V
(1)
(2)
(3)
(4)
(5)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Operation above 4.8V input voltage for extended periods may affect device reliability.
All voltage values are with respect to network ground terminal.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T A(max) ) is dependent on the maximum operating temperature (T INT(max) ), the
maximum power dissipation of the device in the application (P D(max) ), and the junction-to-ambient thermal resistance of the part/package
in the application ( θ JA ), as given by the following equation: T A(max) = T J(max) –( θ JA X P D(max) ). To achieve optimum performance, it is
recommended to operate the device with a maximum internal temperature of 105°C.
The human body model is a 100-pF capacitor discharged through a 1.5-k ? resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
THERMAL INFORMATION
TPS8267xSIP
THERMAL METRIC
(1) (2)
SIP
UNITS
8 PINS
θ JA
θ JCtop
θ JB
ψ JT
ψ JB
θ JCbot
Junction-to-ambient (top) thermal resistance
Junction-to-ambient (bottom) thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
125
70
°C/W
(1)
(2)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953 .
Thermal data have been measured using TI's 4-layer evaluation board.
RECOMMENDED OPERATING CONDITIONS
MIN
NOM MAX
UNIT
V IN
Input voltage range
2.3
4.8 (1)
V
I O
Output current range
Additional output capacitance (PFM/PWM operation) (2)
TPS82671 to TPS826765
TPS82670 to TPS82676
TPS826711, TPS826765
0
0
600
2.5
mA
μF
Additional output capacitance (PWM operation) (2)
TPS82677, TPS82678
0
0
4
7
μF
μF
T A
T J
Ambient temperature
Operating junction temperature
–40
–40
+85
+125
°C
°C
(1)
(2)
Operation above 4.8V input voltage for extended periods may affect device reliability.
In certain applications larger capacitor values can be tolerable, see output capacitor selection section for more details.
Copyright ? 2010–2012, Texas Instruments Incorporated
3
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
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TPS82674SIP 制造商:TI 制造商全称:Texas Instruments 功能描述:600-mA, HIGH-EFFICIENCY MicroSiP? STEP-DOWN CONVERTER (PROFILE <1.0mm)