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参数资料
| 型号： | TRA2525 |
| 厂商： | ON Semiconductor |
| 文件页数： | 7/8页 |
| 文件大小： | 71K |
| 描述： | DIODE FAST REC 25A 250V BUTTON |
| 产品变化通告： | Product Discontinuation 02/Jan/2007 |
| 标准包装： | 5,000 |
| 二极管类型： | 标准 |
| 电压 - (Vr)（最大）： | 250V |
| 电流 - 平均整流 (Io)： | 25A |
| 电压 - 在 If 时为正向 (Vf)（最大）： | 1.18V @ 100A |
| 速度： | 标准恢复 >500ns，> 200mA（Io） |
| 电流 - 在 Vr 时反向漏电： | 10µA @ 250V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | Microde 按钮 |
| 供应商设备封装： | Microde 按钮 |
| 包装： | 散装 |
TRA2525 MR3025
http://onsemi.com
7
Button holding fixtures for use during soldering may be
of various materials. Stainless steel has a longer use life
while black anodized aluminum is less expensive and will
limit heat reflection and enhance absorption. The assembly
volume will influence the choice of materials. Fixture
dimension tolerances for locating the button must allow for
expansion during soldering as well as allowing for button
clearance.
Heating Techniques
The following four heating methods have their
advantages and disadvantages depending on volume of
buttons to be soldered.
1.
Belt furnaces
readily handle large or small
volumes and are adaptable to establishment of
aon±line'' assembly since a variable belt speed sets
the run rate. Individual furnace zone controls make
excellent temperature control possible.
2.
Flame Soldering
involves the directing of natural
gas flame jets at the base of a heatsink as the
heatsink is indexed to various loading±heating±
cooling±unloading positions. This is the most
economical labor method of soldering large
volumes. Flame soldering offers good temperature
control but requires sophisticated temperature
monitoring systems such as infrared.
3.
Ovens
are good for batch soldering and are
production limited. There are handling problems
because of slow cooling. Response time is load
dependent, being a function of the watt rating of the
oven and the mass of parts. Large ovens may not
give an acceptable temperature gradient. Capital
cost is low compared to belt furnaces and flame
soldering.
4.
Hot Plates are good for soldering small quantities
of prototype devices. Temperature control is fair
with overshoot common because of the exposed
heating surface. Solder flow and positioning can be
corrected during soldering since the assembly is
exposed. Investment cost is very low.
Regardless of the heating method used, a soldering profile
giving the time±temperature relationship of the particular
method must be determined to assure proper soldering.
Profiling must be performed on a scheduled basis to
minimize poor soldering. The time±temperature
relationship will change depending on the heating method
used.
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PDF描述 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TRA2525/D | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Medium-Current Silicon Rectifiers |
| TRA2532 | 功能描述:TVS 二极管 - 瞬态电压抑制器 32A 24-32V Transient RoHS:否 制造商:Vishay Semiconductors 极性:Bidirectional 工作电压: 击穿电压:58.9 V 钳位电压:77.4 V 峰值浪涌电流:38.8 A 系列: 封装 / 箱体:DO-214AB 最小工作温度:- 55 C 最大工作温度:+ 150 C |
| TRA2532/D | 制造商:ONSEMI 制造商全称:ON Semiconductor 功能描述:Overvoltage Transient Suppresor |
| TRA25B103MGS | 功能描述:多层陶瓷电容器MLCC - 含引线 .010UF 50.0V RoHS:否 制造商:AVX 电容:470 pF 容差:10 % 电压额定值:3 kV 端接类型:Radial 工作温度范围: 温度系数/代码:X7R 引线间隔:5.08 mm 产品:Automotive MLCCs 引线类型: |
| TRA25D223KGS | 功能描述:多层陶瓷电容器MLCC - 含引线 .022UF 100V 10% HT RoHS:否 制造商:AVX 电容:470 pF 容差:10 % 电压额定值:3 kV 端接类型:Radial 工作温度范围: 温度系数/代码:X7R 引线间隔:5.08 mm 产品:Automotive MLCCs 引线类型: |
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