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参数资料
| 型号： | TSA5060AT/C1,518 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | PLL合成/DDS/VCOs |
| 英文描述： | PLL FREQUENCY SYNTHESIZER, 1300 MHz, PDSO16 |
| 封装： | 3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16 |
| 文件页数： | 14/24页 |
| 文件大小： | 119K |
| 代理商： | TSA5060AT/C1,518 |
2000 Oct 24
21
Philips Semiconductors
Product specication
1.3 GHz I2C-bus controlled low phase
noise frequency synthesizer
TSA5060A
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TSA5060ATS | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:1.3 GHz I2C-bus controlled low phase noise frequency synthesizer |
| TSA5060ATS/C1,118 | 功能描述:IC SYNTH FREQ 1.3GHZ 16-SSOP RoHS:是 类别:集成电路 (IC) >> 时钟/计时 - 时钟发生器，PLL，频率合成器 系列:- 产品变化通告:Product Discontinuation 04/May/2011 标准包装:96 系列:- 类型:时钟倍频器，零延迟缓冲器 PLL:带旁路 输入:LVTTL 输出:LVTTL 电路数:1 比率 - 输入:输出:1:8 差分 - 输入:输出:无/无 频率 - 最大:133.3MHz 除法器/乘法器:是/无 电源电压:3 V ~ 3.6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:16-TSSOP（0.173"，4.40mm 宽） 供应商设备封装:16-TSSOP 包装:管件 其它名称:23S08-5HPGG |
| TSA5060ATS/C2,118 | 制造商:NXP Semiconductors 功能描述: |
| TSA-5090 | 制造商:Quest Technology International Inc 功能描述: |
| TSA-5091 | 制造商:Quest Technology International Inc 功能描述: |
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