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参数资料
| 型号： | TSL1401CS-LF |
| 厂商： | AMS-TAOS USA Inc |
| 文件页数： | 4/19页 |
| 文件大小： | 680K |
| 描述： | IC OPTO SENSOR ARRAY CSP PCB MT |
| 标准包装： | 1 |
| 系列： | * |
| 其它名称： | TSL1401-CS-LFDKR |
TSL1401CSLF
128 ?1 LINEAR SENSOR ARRAY WITH HOLD
TAOS072E APRIL 2007
3
The LUMENOLOGY r Company
r
r
Copyright E 2007, TAOS Inc.
www.taosinc.com
Available Options
DEVICE
T
A
PACKAGE LEADS
PACKAGE DESIGNATOR
ORDERING NUMBER
TSL1401CSLF
40癈 to 100癈
Solder Bump Lead Free 8
TSL1401CSLF
Absolute Maximum Ratings
Supply voltage range, V
DD
0.3 V to 6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
0.3 V to V
DD
+ 0.3V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
IK
(V
I
< 0) or (V
I
> V
DD
)
20 mA to 20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, I
OK
(V
O
< 0 or V
O
> V
DD
)
25 mA to 25 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high impedance or power-off state, V
O
0.3 V to V
DD
+ 0.3 V
. . .
Continuous output current, I
O
(V
O
= 0 to V
DD
)
25 mA to 25 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through V
DD
or GND
40 mA to 40 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog output current range, I
O
25 mA to 25 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum light exposure at 638 nm
5 mJ/cm
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
40癈 to 100癈
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
40癈 to 100癈
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Solder reflow temperature, case exposed for 10 seconds
260癈
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions (see Figure 1 and Figure 2)
MIN
NOM
MAX
UNIT
Supply voltage, V
DD
3
5
5.5
V
Input voltage, V
I
0
V
DD
V
High-level input voltage, V
IH
2
V
DD
V
Low-level input voltage, V
IL
0
0.8
V
Wavelength of light source, ?/DIV>
400
1000
nm
Clock frequency, f
clock
5
8000
kHz
Sensor integration time, t
int
(see Note 1)
0.03375
100
ms
Setup time, serial input, t
su(SI)
20
ns
Hold time, serial input, t
h(SI)
(see Note 2)
0
ns
Operating free-air temperature, T
A
40
85
癈
NOTES: 1. Integration time is calculated as follows:
t
int
(min)
= (128 18) y clock period + 20 ms
where 128 is the number of pixels in series, 18 is the required logic setup clocks, and 20 ms is the pixel charge transfer time (t
qt
)
2. SI must go low before the rising edge of the next clock pulse.
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