
24
TSPC106
2102B–HIREL–02/02
Electrical Characteristics
General Requirements
All static and dynamic electrical characteristics specified for inspection purposes and the
relevant measurement conditions are given in
Table 15.Notes:
1. Excludes test signals (LSSD_MODE and JTAG signals).
2. This value represents worst case 40 Ohm drivers (default value for Processor/L2 control signals CI,WT,GBL, TBST,TSIZ[0-
2], TT[0-4], TWE, and TV) only. Other signals have lower default driver impedance and will support larger IOH and IOL.All
drivers may optionally be programmed to different driver strengths.
3. Capacitance is periodically sampled rather than 100% tested.
Table 14. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Notes
Supply voltage
VDD
3.3
± 165 mv
V
PLL supply voltage
AVDD
Min 2.51 - Max 3.465
V
Input voltage
V
in
0to 5.5
V
Die junction
temperature
T
j
0to 105
°C
The extended temperature parts
have die junction temperature of -40
to 105°C
Table 15. Clock DC Timing Specifications (V
DD = 3.3V ± 5% dc, GND = 0V dc, -55°C ≤ T
C ≤ 125°C)
Symbol
Characteristic
Min
Max
Unit
VIH
Input high voltage (all inputs except SYSCLK)
2
5.5
V
IL
Input low voltage (all inputs except SYSCLK)
GND
0.8
V
CV
IH
SYSCLK input high voltage
2.4
5.5
V
CV
IL
SYSCLK input low voltage
GND
0.4
V
Iin
Input leakage current, VIN =3.3V
(1)
15.0
A
ITSI
Hi-Z (off-state) leakage current, VIN =3.3V
(1)
15.0
A
VOH
Output high voltage, IOH =-7mA
2.4
V
OL
Output low voltage, I
OL =7 mA
0.5
V
OH
PCI 3.3V signaling output high voltage,
I
OH =-0.5mA
2.7
V
VOL
PCI 3.3V signaling output low voltage, IOL =1.5 mA
0.3
V
Cin
Capacitance, Vin = 0V,f= 1 MHz
(2)
7.0
pF