参数资料
型号: TVP5158PNPR
厂商: TEXAS INSTRUMENTS INC
元件分类: 颜色信号转换
英文描述: COLOR SIGNAL DECODER, PQFP128
封装: GREEN, PLASTIC, HTQFP-128
文件页数: 108/108页
文件大小: 1395K
代理商: TVP5158PNPR
U1B
TVP5158
AIN_1
95
AIN_2
94
AIN_3
93
AIN_4
92
SD_M
89
SD_R
88
LRCLK_R
86
SD_CO
83
BCLK_R
85
LRCLK_CI
16
BCLK_CI
17
SD_CI
19
R62
5.6 kW
R61
5.6 kW
R63
5.6 kW
C67
2.2 F
C65
2.2 F
C66
2.2 F
C68
2.2 F
R64
5.6 kW
J1A
RCA_Octal_stack
1
6
5
7
8
2
R65
5.6 kW
R67
5.6 kW
R66
5.6 kW
R60
5.6 kW
SLES243E
– JULY 2009 – REVISED MARCH 2011
NOTE: System level ESD protection is not included in above application circuit but is recommended.
NOTE: Resistor divider may vary dependent on expected max input audio levels. Desired analog audio input levels should
not exceed 1Vpp.
Figure 6-6. Audio Input Connectivity
6.5
Designing with PowerPAD
Devices
The TVP5158 device is housed in a high-performance, thermally enhanced, 128-terminal PowerPAD
package. Use of the PowerPAD package does not require any special considerations except to note that
the thermal pad, which is an exposed die pad on the bottom of the device, is a metallic thermal and
electrical conductor. Therefore, if not implementing the PowerPAD PCB features, the use of solder masks
(or other assembly techniques) can be required to prevent any inadvertent shorting by the exposed
thermal pad of connection etches or vias under the package. The recommended option, however, is not to
run any etches or signal vias under the device, but to have only a grounded thermal land as in the
following explanation. Although the actual size of the exposed die pad may vary, the minimum size
required for the keep-out area for the 128-terminal PFP PowerPAD package is 9mm x 9mm.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPAD package. The thermal land varies in size, depending on the PowerPAD package being used,
the PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land may
or may not contain numerous thermal vias depending on PCB construction.
Other requirements for using thermal lands and thermal vias are detailed in the TI application note
PowerPAD Thermally Enhanced Package application report (SLMA002).
For the TVP5158 device, this thermal land must be grounded to the low-impedance ground plane of the
device. This improves not only thermal performance but also the electrical grounding of the device. It is
also recommended that the device ground terminal landing pads be connected directly to the grounded
thermal land. The land size should be as large as possible without shorting device signal terminals. The
thermal land can be soldered to the exposed thermal pad using standard reflow soldering techniques.
While the thermal land can be electrically floated and configured to remove heat to an external heat sink, it
is recommended that the thermal land be connected to the low-impedance ground plane for the device.
More information can be obtained from the TI application note PHY Layout (SLLA020).
Copyright
2009–2011, Texas Instruments Incorporated
Application Information
99
Product Folder Link(s): TVP5158 TVP5157 TVP5156
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