参数资料
型号: TWR-MCF51JE-KIT
厂商: Freescale Semiconductor
文件页数: 8/47页
文件大小: 0K
描述: TOWER SYSTEM KIT MCF51JE
标准包装: 1
系列: ColdFire®, Flexis™
类型: MCU
适用于相关产品: Freescale 电源塔系统,MCF51JE
所含物品: 4 个板,线缆,文档,DVD
MCF51JE256 Datasheet, Rev. 4
Preliminary Electrical Characteristics
Freescale Semiconductor
16
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD).
3.3
Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or
VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
loads), the difference between pin voltage and VSS or VDD will be very small.
Table 5. Absolute Maximum Ratings
#
Rating
Symbol
Value
Unit
1
Supply voltage
VDD
–0.3 to 3.8
V
2
Maximum current into VDD
IDD
120
mA
3
Digital Input voltage
VIn
–0.3 to VDD + 0.3
V
4
Instantaneous maximum current
Single pin limit (applies to all port pins)1, 2, 3
1
Input must be current limited to the value specified. To determine the value of the required current-limiting resistor,
calculate resistance values for positive (VDD) and negative (VSS) clamp voltages, then use the larger of the two
resistance values.
2
All functional non-supply pins are internally clamped to VSS and VDD.
3
Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum
current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may flow out of VDD
and could result in external power supply going out of regulation. Ensure external VDD load will shunt current greater
than maximum injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low (which would reduce overall power consumption).
ID
25
mA
5
Storage temperature range
Tstg
–55 to 150
C
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