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参数资料
| 型号： | TXM-869-ES_ |
| 厂商： | Linx Technologies Inc |
| 文件页数： | 7/11页 |
| 文件大小： | 0K |
| 描述： | XMITTER RF 869MHZ 10PIN SMD |
| 产品变化通告： | ES Series Frequency Change 22/Dec/2010 |
| 标准包装： | 40 |
| 系列： | ES |
| 频率： | 869MHz |
| 应用： | 住宅/楼宇自动化，工业控制和监控 |
| 调制或协议： | AM，OOK |
| 数据传输率 - 最大： | 56 kbps |
| 功率 - 输出： | 4dBm |
| 电流 - 传输： | 8.5mA |
| 数据接口： | PCB，表面贴装 |
| 天线连接器： | PCB，表面贴装 |
| 电源电压： | 2.1 V ~ 4 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 模块 |
| 包装： | 散装 |
| 其它名称： | TXM-869-ES TXM-869-ES_-ND |
PAD LAYOUT
The following pad layout diagram is designed to facilitate both hand and
automated assembly.
0.065"
0.610"
0.070"
0.100"
Figure 13: Recommended PCB Layout
PRODUCTION GUIDELINES
AUTOMATED ASSEMBLY
For high-volume assembly, most users will want to auto-place the modules. The
modules have been designed to maintain compatibility with reflow processing
techniques; however, due to the their hybrid nature, certain aspects of the
assembly process are far more critical than for other component types.
Following are brief discussions of the three primary areas where caution must be
observed.
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the reflow
stage. The reflow profile below should not be exceeded, since excessive
temperatures or transport times during reflow will irreparably damage the
modules. Assembly personnel will need to pay careful attention to the oven’s
profile to ensure that it meets the requirements necessary to successfully reflow
all components while still remaining within the limits mandated by the modules.
The figure below shows the recommended reflow oven profile for the modules.
The modules are housed in a hybrid SMD package that supports hand or
automated assembly techniques. Since the modules contain discrete
components internally, the assembly procedures are critical to ensuring the
reliable function of the modules. The following procedures should be reviewed
with and practiced by all assembly personnel.
HAND ASSEMBLY
Pads located on the bottom of the
Soldering Iron
module are the primary mounting
surface. Since these pads are
Tip
inaccessible during mounting,
300
250
200
150
100
255°C
235°C
217°C
185°C
180°C
125°C
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
castellations that run up the side of
the module have been provided to
facilitate solder wicking to the
Solder
50
module’s underside. This allows for
very quick hand soldering for
PCB Pads
Castellations
0
30
60
90
120
150
180
210
240
270
300
330
360
prototyping and small volume
Time ( S econd s )
production.
Figure 14: Soldering Technique
Figure 15: Maximum Reflow Profile
If the recommended pad guidelines have been followed, the pads will protrude
slightly past the edge of the module. Use a fine soldering tip to heat the board
pad and the castellation, then introduce solder to the pad at the module’s edge.
The solder will wick underneath the module, providing reliable attachment. Tack
one module corner first and then work around the device, taking care not to
exceed the times listed below.
Absolute Maximum Solder Times
Hand-Solder Temp. TX +225°C for 10 Seconds
Hand-Solder Temp. RX +225°C for 10 Seconds
Recommended Solder Melting Point +180°C
Reflow Oven: +220°C Max. (See adjoining diagram)
Page 12
Shock During Reflow Transport
Since some internal module components may reflow along with the components
placed on the board being assembled, it is imperative that the modules not be
subjected to shock or vibration during the time solder is liquid. Should a shock
be applied, some internal components could be lifted from their pads, causing
the module to not function properly.
Washability
The modules are wash resistant, but are not hermetically sealed. Linx
recommends wash-free manufacturing; however, the modules can be subjected
to a wash cycle provided that a drying time is allowed prior to applying electrical
power to the modules. The drying time should be sufficient to allow any moisture
that may have migrated into the module to evaporate, thus eliminating the
potential for shorting damage during power-up or testing. If the wash contains
contaminants, the performance may be adversely affected, even after drying.
Page 13
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TXM-869-ES_ | 功能描述:XMITTER RF 869MHZ 10PIN SMD RoHS:是 类别:RF/IF 和 RFID >> RF 发射器 系列:ES 标准包装:4,000 系列:- 频率:310MHz ~ 440MHz 应用:- 调制或协议:UHF，ASK 数据传输率 - 最大:20 kBaud 功率 - 输出:1dBm ~ 5dBm 电流 - 传输:10mA 数据接口:PCB，表面贴装 天线连接器:PCB，表面贴装 存储容量:- 特点:- 电源电压:2.2 V ~ 4 V 工作温度:-40°C ~ 85°C 封装/外壳:16-LSSOP（0.154"，3.90mm 宽） 包装:带卷 (TR) |
| TXM-900-HP3-PPO | 功能描述:射频模块 RF Transmitter 900MHz 8-CH SIP Pack RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
| TXM-900-HP3-PPO_ | 功能描述:TRANSMITTER RF 900MHZ 8-CHANNEL RoHS:是 类别:RF/IF 和 RFID >> RF 发射器 系列:HP3 标准包装:4,000 系列:- 频率:310MHz ~ 440MHz 应用:- 调制或协议:UHF，ASK 数据传输率 - 最大:20 kBaud 功率 - 输出:1dBm ~ 5dBm 电流 - 传输:10mA 数据接口:PCB，表面贴装 天线连接器:PCB，表面贴装 存储容量:- 特点:- 电源电压:2.2 V ~ 4 V 工作温度:-40°C ~ 85°C 封装/外壳:16-LSSOP（0.154"，3.90mm 宽） 包装:带卷 (TR) |
| TXM-900-HP3-PPS | 功能描述:射频模块 RF Transmitter900MHz 8&100-CH SIP Pack RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
| TXM-900-HP3-PPS_ | 制造商:Linx Technologies Inc 功能描述:TRANSMTR RF 900MHZ 8PAR/120SRLCH |
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