参数资料
型号: TXS75ZA-NP2R
厂商: POWER-ONE INC
元件分类: 电源模块
英文描述: 1-OUTPUT 112 W DC-DC REG PWR SUPPLY MODULE
封装: 2.400 X 3.450 INCH, 0.500 INCH HEIGHT, 3/4 BRICK PACKAGE-14
文件页数: 18/27页
文件大小: 2635K
代理商: TXS75ZA-NP2R
Product Specification
TXS Series: 75…120 A DC-DC Converters
36 to 75 V DC Input, 1.2, 1.5, 1.8, 2.0 and 2.5 V Output, 90 W to 250 W
REV. FEB 18, 2003
25 of 27
www.power-one.com
The converter itself does not set the derating as for
example the output current limit. It is the
responsibility of the end user to decide how much
current/power can be drawn in his design or how
much airflow is required, in order to ensure reliable
operation in the field.
Calculator
Instead of using the graphs, the required airflow or
the allowed output current can be calculated with a
automated, easy to use tool on the TXS Product
CD ROM. The tool uses interpolation between
values and also gives a prediction of the expected
life time for the chosen operating condition. 120A
units are not jet included.
Important Reminder
Reliability
The reliability of TXS converters was verified using
the MIL-HDBK and the Physics of failure approach.
Reliability Prediction
Reliability prediction is a calculation method, based
on the analysis of component failure rates of a
product or a system, with the target to predict the
rate at which the product will fail. It also pinpoints
areas for potential reliability improvements.
The basis of the analysis is a general reliability
prediction model, which describes how the
components react to electrical, thermal and
mechanical stress.
There are several calculation models available:
MIL-HDBK 217-F Notice 2
Belcore TR-332
PRISM
CNET RDF
Alternatively to this standardised calculation
methods, some companies use models based on
experience, returns and field data. This makes it
very difficult to compare reliability data from
different manufacturers. Especially if models from
the MIL-HDBK are used for components with good
reliability data only, and “in house” models for all
the others.
MIL HDBK 217F Notice 2
There is an ongoing discussion about the best
suited method for reliability prediction.
The MIL-HDBK is the most elaborate, well
documented and most widely used tool for
predicting the component reliability. MIL models
are better suited to describing the component
loading in high density converters, than other
models. Belcore models for example were
developed for predicting the reliability of standard
telecom equipment, working at much lower
operating temperatures.
The problem with the MIL HDBK is, that the
models are often based on old data, neglecting
component improvements achieved in the market.
This leads to pessimistic results. Bad prediction
results, related design restrictions and resulting
higher product costs were the main reasons why
the US government recently cancelled the use of
the MIL-HDBK 217 in army specifications.
For power supplies however there is no real
alternative for predicting reliability in sight.
Because it is easy to use and has models for all
components included, the MIL-HDBK-217 is still
the best method to get a quantitative measure of
the reliability.
Physics of failure (PoF)
Because of the limitations of reliability prediction,
PoF is used as a second tool for a qualitative
measure of the reliability.
The Physics of failure approach defines a set of
specific screening and stress tests to detect
possible failure mechanism, to analyse the stress
response of the modules and verify their safety
margins.
The TXS CD ROM contains the results from a
“Design Maturity” and a “Design Integrity” test as a
part of the PoF analysis.
Background information about reliability prediction
and detection methods, the assumptions for the
calculation with the MIL HDBK and detailed results
can be found in the “reliability report for TXS DC-
DC Converters” on the TXS product CD ROM.
A reliability prediction gives not an exact value
for an individual module, but a statistical
estimate for an equipment population in the
field.
Calculations and graphs only give a rough
guide to the required cooling. The specific card
and rack design can vary a lot, which makes it
almost impossible to predict the exact
temperatures of a Brick.
It is good practice to verify the thermal
performance in worst case operating conditions
with all obstructions in place at highest ambient
temperature before the card design is finished.
相关PDF资料
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