参数资料
型号: TZA3047BVH/C1,551
厂商: NXP Semiconductors
文件页数: 2/28页
文件大小: 0K
描述: IC LASER DRIVER 1.25GBPS 32-HBCC
标准包装: 490
类型: 激光二极管驱动器(光纤)
数据速率: 1.25Gbps
通道数: 1
电源电压: 3.14 V ~ 3.47 V
电流 - 电源: 40mA
电流 - 调制: 100mA
电流 - 偏置: 100mA
工作温度: -40°C ~ 85°C
封装/外壳: 32-HBCC
供应商设备封装: 32-HBCC(5x5)
包装: 托盘
安装类型: 表面贴装
其它名称: 568-1189
935270561551
TZA3047BVHW-S
Philips Semiconductors
30 Mbits/s up to 1.25 Gbits/s laser drivers
Product speci?cation
TZA3047A; TZA3047B
CONTENTS
FEATURES
11
12
AC CHARACTERISTICS
APPLICATION INFORMATION
1.1
1.2
1.3
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
8
9
10
General
Control features
Protection features
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Data and clock input
Retiming
Pulse width adjustment
Modulator output stage
Dual-loop control
Average loop control
Direct current setting
Soft start
Alarm functions
Enable
Reference block
LIMITING VALUES
THERMAL CHARACTERISTICS
DC CHARACTERISTICS
12.1
12.1.1
12.1.2
12.1.3
12.1.4
12.1.5
12.1.6
12.2
12.3
12.4
13
14
15
15.1
15.2
15.3
15.4
15.5
16
17
18
Design equations
Bias and modulation currents
Average monitor current and extinction ratio
Dual-loop control
Alarm operating current
Alarm monitor current
Pulse width adjustment
TZA3047A with dual-loop control
TZA3047B with dual-loop control
TZA3047B with average loop control
BONDING PAD LOCATIONS
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2003 Jun 05
2
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