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参数资料
| 型号： | UBA2033TS/N2,118 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 15/18页 |
| 文件大小： | 0K |
| 描述： | IC FULL BRIDGE DRIVER 28-SSOP |
| 标准包装： | 1 |
| 配置： | 半桥 |
| 输入类型： | 自振荡 |
| 电流 - 峰： | 130mA |
| 配置数： | 1 |
| 输出数： | 4 |
| 高端电压 - 最大（自引导启动）： | 550V |
| 电源电压： | 10.5 V ~ 13.5 V |
| 工作温度： | -40°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 28-SSOP（0.209"，5.30mm 宽） |
| 供应商设备封装： | 28-SSOP |
| 包装： | 标准包装 |
| 产品目录页面： | 844 (CN2011-ZH PDF) |
| 其它名称： | 568-3326-6 |
NXP Semiconductors
HF full bridge driver IC
Product specification
UBA2033
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
BGA, HBGA, LFBGA, SQFP, TFBGA
WAVE
not suitable
REFLOW (1)
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
not
suitable (2)
suitable
PLCC (3) , SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not
not
recommended (3)(4)
recommended (5)
suitable
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
2. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
3. If wave soldering is considered, then the package must be placed at a 45 ° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2002 Oct 08
15
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