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参数资料
| 型号： | UPG2422TK-E2-A |
| 厂商： | CEL |
| 文件页数： | 14/16页 |
| 文件大小： | 0K |
| 描述： | IC MMIC SWITCH SPDT 6-MINIMOLD |
| 标准包装： | 5,000 |
| RF 型： | 802.11a/b/g/n |
| 频率： | 50MHz ~ 6GHz |
| 特点： | SPDT |
| 封装/外壳： | 6-SMD，扁平引线 |
| 供应商设备封装： | 6-迷你型模塑 |
| 包装： | 带卷 (TR) |
? PG2422TK
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Peak temperature (package surface temperature) : 260 ? C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220 ? C or higher
: 60 seconds or less
Preheating time at 120 to 180 ? C
: 120 ? 30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Condition Symbol
IR260
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
: 260 ? C or below
: 10 seconds or less
WS260
Preheating temperature (package surface temperature) : 120 ? C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
Partial Heating
Peak temperature (terminal temperature)
Soldering time (per side of device)
: 350 ? C or below
: 3 seconds or less
HS350
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
CAUTION
Do not use different soldering methods together (except for partial heating).
R09DS0013EJ0100 Rev.1.00
Jan 20, 2011
Page 14 of 15
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