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参数资料
| 型号： | W185-5 |
| 厂商： | Cypress Semiconductor Corp. |
| 英文描述： | Six Output Peak Reducing EMI Solution |
| 中文描述： | 六输出峰值抑制EMI解决方案 |
| 文件页数： | 8/8页 |
| 文件大小： | 116K |
| 代理商： | W185-5 |
W185
Cypress Semiconductor Corporation, 2000. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Package Diagram
24-Pin Shrink Small Outline Package (SSOP, 209-mil)
8
°
0
°
0.09
COMMON
DIMENSIONS
MIN.
0.05
1.68
0.25
0.25
0.09
MAX.
N
6
O
N
E
T
4
NOTE
VARI-
AA
AB
AC
AD
AE
AF
SEE VARIATIONS
SEE VARIATIONS
5.20
L
C
O
R
1
N
H
e
E
D
A
A
2
b
b1
c
A
O
L
Y
M
B
S
MAX.
6.33
6.33
7.33
8.33
10.33
10.33
MIN.
6.07
6.07
7.07
8.07
10.07
10.07
NOM.
0.13
1.73
-
0.15
ND
6.20
6.20
7.20
8.20
10.20
10.20
32289
2 of 2
1
A1
THIS TABLE IN MILLIMETERS
8/1
0.65 BSC
7.80
1.78
0.38
0.33
0.20
0.21
5.30
5.38
7.65
0.63
0.75
1.25 REF.
7.90
0.95
14
16
20
24
28
30
6
4
4
5
.407
.402
.397
.407
.402
.397
.328
.323
.318
.289
.284
.278
.249
.244
.239
5
4
4
6
30
28
AF
24
AE
20
AD
16
AC
14
AB
AA
.037
.311
.307
.030
.025
.301
.212
.209
.205
.066
.010
.010
.004
.004
.002
.008
.070
.015
.013
.008
.006
.068
-
.005
.0256 BSC
THIS TABLE IN INCHES
2
A
b
b1
c
c1
ND
4
°
.006
NOM.
MIN.
MAX.
S
B
M
Y
L
O
A
A
D
E
e
H
L
L1
N
O
R
1
SEE VARIATIONS
SEE VARIATIONS
0
°
.004
ATIONS
NOTE
4
T
E
N
O
6
N
C
MAX.
MIN.
DICOMMON
8
°
REV.
05
DWG. NO.
SIZE
SHEET
SCALE
8
7
6
5
4
3
2
A
B
C
D
E
8
7
6
5
4
3
2
1
A
B
C
D
E
VARIATION AF
0.30
-
IS DESIGNED BUT NOT TOOLED
c1
0.09
0.15
0.16
.012
-
8,10
10
10
10
10
10
10
8,10
.006
L1
.049 REF.
TITLE
PACKAGE OUTLINE,
5.30mm (.209") BODY, SSOP
-D-
A
- T -
e
OC
C
b
A
1
N
1.00 DIA.
1 of 2
1
A1
32289
H
3
4
4
A
2
6
PARTING LINE
5.30mm (.209") BODY, SSOP
PACKAGE OUTLINE,
SIDE VIEW
END VIEW
DETAIL 'A'
TOP VIEW
SEATING
PLANE
-E-
1
2
3
DSEE
5
L1
- C -
2.36
BOTTOM VIEW
E/2
D/2
1.00
1.00
DIA. PIN
7
8
7.
6.
CONTROLLING DIMENSION: MILLIMETERS.
10. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.25mm FROM LEAD TIPS.
THIS PACKAGE OUTLINE DRAWING COMPLIES WITH
JEDEC SPECIFICATION NO. MO-150 FOR THE LEAD COUNTS SHOWN
9.
1.
2.
MAXIMUM DIE THICKNESS ALLOWABLE IS 0.43mm (.017 INCHES).
DIMENSIONING & TOLERANCES PER ANSI.Y14.5M-1982.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13mm TOTAL IN
EXCESS OF b DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION b BY MORE
THAN 0.07mm AT LEAST MATERIAL CONDITION.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION.
8.
ONE ANOTHER WITHIN 0.08mm AT SEATING PLANE.
PI
N
E
-
P
H
I
L
I
P
5.
4.
3.
FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
FOR SOLDERING TO A SUBSTRATE.
DIMENSION IS THE LENGTH OF TERMINAL
PROTRUSIONS SHALL NOT EXCEED 0.15mm PER SIDE.
AT THE PARTING LINE, MOLD FLASH OR
DO INCLUDE MOLD MISMATCH AND ARE MEASURED
INCLUDE MOLD FLASH OR PROTRUSIONS, BUT
"D" & "E" ARE REFERENCE DATUMS AND DO NOT
"T" IS A REFERENCE DATUM.
NOTES:
C
0.076
M
+
E
M
0.20
S
D
0.12
M T
E
+
G
G
0.25 BSC
GAUGE PLANE
SEATING PLANE
b1
c
b
c1
BASE METAL
8.
10.
SECTION G-G
WITH LEAD FINISH
11.
L
05
00
01
02
03
04
05
INITIAL RELEASE PER DCN#A33907.
REVISED PER DCN#D20214.
REVISED PER DCN#D20760.
REVISED PER DCN#D21151.
REVISED PER DCN#D22219.
REVISED PER DCN#P60056.
1991
11/05
1992
11/08
1993
04/26
1994
06/19
1995
03/19
1996
06/13
M. CHAVEZ
M. BANGLOY
H. BAUTISTA
H.J. CHOI
6/13
1991
6/13
1991
6/13
1991
6/13
1991
HJC
YMK
EBA
EBA
EBA
J.B.C.
0
°
MIN.
.235 MIN
R
12-16
°
MATERIAL
FINISH
ENG'R
CHECKED
REV.
DWG. NO.
SIZE
SHEET
SCALE
DO NOT SCALE DRAWING
DECIMAL
XX±
XXX±
XXXX±
ANGULAR
±
ORIGINATOR
DATE
DESCRIPTION
REV.
PROJECTION
TITLE
8
7
6
5
4
3
2
A
B
C
D
E
8
7
6
5
4
3
2
1
A
B
C
D
E
ASSEMBLY AND TEST
EXCELLENCE IN SEMICONDUCTOR
Anam Industrial Co., LTD.
Seoul, Korea
AIrving, TX
Manila, Philippines
AChandler, AZ
Amkor/Anam Pilipinas, INC.
RELEASED
DRAWN
APPROVALS
DATE
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