参数资料
型号: W24257C-70LL
厂商: WINBOND ELECTRONICS CORP
元件分类: SRAM
英文描述: 32K X 8 STANDARD SRAM, 70 ns, PDIP28
封装: 0.600 INCH, PLASTIC, DIP-28
文件页数: 11/11页
文件大小: 211K
代理商: W24257C-70LL
Preliminary W24257C
Publication Release Date: January 1999
- 9 -
Revision A1
PACKAGE DIMENSIONS
28-pin P-DIP
Seating Plane
1. Dimension D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
6. General appearance spec. should be based on
final visual inspection spec.
.
1.63
1.47
0.064
0.058
Notes:
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
B
c
D
e
A
L
S
A
1
2
E
0.060
1.52
0.210
5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.540
0.550
0.545
13.72
13.97
13.84
17.02
15.24
14.99
15.49
0.600
0.590
0.610
2.29
2.54
2.79
0.090
0.100
0.110
B1
1
e
E1
a
1.460
1.470
37.08
37.34
0
15
0.090
2.29
0.650
0.630
16.00
16.51
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
15
0
eA
2
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
28
1
15
14
28-pin P-DIP Skinny
1. Dimension D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
6. General appearance spec. should be based on
final visual inspection spec.
1.63
1.47
0.064
0.058
Notes:
Symbol
Min.
Nom.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
B
c
D
e
A
L
S
A
1
2
E
0.060
1.52
0.175
4.45
0.010
0.125
0.016
0.130
0.018
0.135
0.022
3.18
0.41
0.25
3.30
0.46
3.43
0.56
0.008
0.120
0.370
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.293
0.288
0.283
7.44
7.32
7.19
9.40
7.87
7.62
8.13
0.310
0.300
0.320
2.29
2.54
2.79
0.090
0.100
0.110
B1
1
e
E1
a
1.388
1.400
35.26
35.56
15°
0.055
1.40
0.350
0.330
8.38
8.89
15°
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
e
A
a
c
E
Base Plane
Mounting Plane
1
A
1
e
L
A
S
1
E
D
1
B
28
15
1
14
2
相关PDF资料
PDF描述
WS128K32N-20H1QA 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66
WS128K32N-25H1QA 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66
WMF2M8-90LC5 2M X 8 FLASH 5V PROM, 90 ns, CQCC44
WE128K16-250CC 128K X 16 EEPROM 5V MODULE, 250 ns, CDMA40
WE128K16-300CI 128K X 16 EEPROM 5V MODULE, 300 ns, CDMA40
相关代理商/技术参数
参数描述
W24257K70LL 制造商:WINBOND 功能描述:New
W24257Q-70L 制造商:未知厂家 制造商全称:未知厂家 功能描述:x8 SRAM
W24257Q-70LE 制造商:未知厂家 制造商全称:未知厂家 功能描述:x8 SRAM
W24257Q-70LL 制造商:未知厂家 制造商全称:未知厂家 功能描述:x8 SRAM
W24257S-70L 制造商:未知厂家 制造商全称:未知厂家 功能描述:x8 SRAM