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参数资料
| 型号： | W24B02B-70LI |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | SRAM |
| 英文描述： | 256K X 8 STANDARD SRAM, 70 ns, PBGA48 |
| 封装： | TFBGA-48 |
| 文件页数： | 10/11页 |
| 文件大小： | 194K |
| 代理商： | W24B02B-70LI |
Preliminary W24B02
- 8 -
DATA RETENTION CHARACTERISTICS
(TA (
°C) = -20 to 85 for LE; -40 to 85 for LI)
PARAMETER
SYM.
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDD for Data Retention
VDR
#CS
≥ VDD -0.2V
1.5
-
V
Data Retention Current
IDDDR #CS
≥ VDD -0.2V, VDD = 3.0V
-
5
A
Chip Deselect to Data
Retention Time
TCDR
See data retention waveform
0
-
nS
Operation Recovery Time
TR
TRC*
-
nS
* Read Cycle Time
DATA RETENTION WAVEFORM
TCDR
VDD
TR
#CS
VDR
1.5V
=
>
- 0.2V
DD
V
#CS =
>
0.9 x
DD
V
0.9 x
DD
V
ORDERING INFORMATION
PART NO.
ACCESS
TIME
(nS)
OPERATING VOLTAGE
(V)
STANDBY CURRENT (
A)
OPERATING
TEMPERATURE
(
°C)
PACKAGE
W24B02B-70LE
70
3V/5
A
-20 to 85
TFBGA
W24B02Q-70LE
70
3V/5
A
-20 to 85
TSOP I (8 x 13.4 mm)
W24B02T-70LE
70
3V/5
A
-20 to 85
TSOP I (8 x 20 mm)
W24B02B-70LI
70
3V/5
A
-40 to 85
TFBGA
W24B02Q-70LI
70
3V/5
A
-40 to 85
TSOP I (8 x 13.4 mm)
W24B02T-70LI
70
3V/5
A
-40 to 85
TSOP I (8 x 20 mm)
W24B02B-55LE
55
3V/5
A
-20 to 85
TFBGA
W24B02Q-55LE
55
3V/5
A
-20 to 85
TSOP I (8 x 13.4 mm)
W24B02T-55LE
55
3V/5
A
-20 to 85
TSOP I (8 x 20 mm)
W24B02B-55LI
55
3V/5
A
-40 to 85
TFBGA
W24B02Q-55LI
55
3V/5
A
-40 to 85
TSOP I (8 x 13.4 mm)
W24B02T-55LI
55
3V/5
A
-40 to 85
TSOP I (8 x 20 mm)
Notes:
1. Winbond reserves the right to make changes to its products without prior notice.
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications
where personal injury might occur as a consequence of product failure.
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