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参数资料
| 型号： | W24L257Q70LL |
| 英文描述： | x8 SRAM |
| 中文描述： | x8的SRAM |
| 文件页数： | 9/11页 |
| 文件大小： | 213K |
| 代理商： | W24L257Q70LL |
W24L257
Publication Release Date: October 3, 2001
- 9 -
Revision A5
BONDING PAD DIAGRAM
23
X
Y
A14
A12
A7
A6
A5
A3
8
22
A2
A10
OEB
A11
A9
A8
WEB
V
DD
V
DD
7
A4
A13
1
2
3
4
5
29
24
25
26
27
6
30
28
11
12
13
15
16
17
18
A0
I/O0 I/O1 I/O2 V
SS
V
SS
I/O4 I/O5 I/O6
19
9
A1
10
20
CSB
14
21
I/O7
I/O3
AC5394
PAD NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
X
Y
-232.25
-351.70
-471.15
-590.60
-710.05
-829.50
-992.79
-992.79
-857.86
-738.41
-594.84
-451.06
-310.67
-171.78
24.45
151.80
298.07
443.28
588.20
732.84
871.11
992.75
992.75
810.09
690.64
571.19
451.74
332.29
120.25
-93.23
1445.22
1445.22
1445.22
1445.22
1445.22
1445.22
1362.24
-1306.11
-1452.79
-1452.79
-1414.13
-1414.13
-1414.13
-1405.28
-1405.28
-1414.13
-1414.13
-1414.13
-1414.13
-1414.13
-1452.79
-1312.15
1373.67
1445.22
1445.22
1445.22
1445.22
1445.22
1444.65
1444.65
Note: For bare chip form (C.O.B.) applications, the substrate must be connected to V
DD
or left floating in the PCB layout.
相关PDF资料 |
PDF描述 |
|---|---|
| W24L257S70LE | x8 SRAM |
| W24L257S70LL | x8 SRAM |
| W250-03 | Clocks and Buffers |
| W254B | Clocks and Buffers |
| W255 | Clocks and Buffers |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W24L257S70LE | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x8 SRAM |
| W24L257S70LL | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x8 SRAM |
| W24LH8 | 制造商:WINBOND 制造商全称:Winbond 功能描述:Normal speed, Very low power CMOS static RAM Organized as 32768 x 8 bits |
| W24LH8Q-55LE | 制造商:WINBOND 制造商全称:Winbond 功能描述:Normal speed, Very low power CMOS static RAM Organized as 32768 x 8 bits |
| W24LH8Q-55LI | 制造商:WINBOND 制造商全称:Winbond 功能描述:Normal speed, Very low power CMOS static RAM Organized as 32768 x 8 bits |
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