参数资料
型号: W25Q16CVDAIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PDIP8
封装: 0.300 INCH, GREEN, PLASTIC, DIP-8
文件页数: 56/79页
文件大小: 1131K
代理商: W25Q16CVDAIP
W25Q16CV
- 6 -
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q16CV is offered in an 8-pin SOIC 150-mil or 208-mil (package code SN & SS), an 8-pad WSON
6x5-mm (package code ZP), an 8-pin PDIP 300-mil (package code DA), a 16-pin SOIC 300-mil (package
code SF) and a 24-ball 8x6-mm TFBGA (package code TC) as shown in Figure 1a-e respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC 150 / 208-mil
1
2
3
4
8
7
6
5
/CS
DO (IO
1)
/WP (IO
2)
GND
VCC
/HOLD (IO
DI (IO
0)
CLK
Top View
3)
Figure 1a. W25Q16CV Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS)
3.2 Pad Configuration WSON 6x5-mm
1
2
3
4
/CS
DO (IO
1)
/WP (IO
2)
GND
VCC
/HOL
DI (IO
CLK
D (IO
3)
0)
Top View
8
7
6
5
Figure 1b. W25Q16CV Pad Assignments, 8-pad WSON 6x5-mm (Package Code ZP)
相关PDF资料
PDF描述
W25Q16CVSNIG 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q16CVZPIG 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
W25Q16CVTCIP 16M X 1 SPI BUS SERIAL EEPROM, PBGA24
WF2M32S-100GTI 8M X 8 FLASH 5V PROM MODULE, 100 ns, CQFP68
WE128K8-200CQ 128K X 8 EEPROM 5V MODULE, 200 ns, CDIP32
相关代理商/技术参数
参数描述
W25Q16CVSFAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVSFAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVSFIG 功能描述:IC SPI FLASH 16MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP(0.465",11.8mm 宽) 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8
W25Q16CVSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16CVSNAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI