参数资料
型号: W25Q16CVDAIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PDIP8
封装: 0.300 INCH, GREEN, PLASTIC, DIP-8
文件页数: 73/79页
文件大小: 1131K
代理商: W25Q16CVDAIP
W25Q16CV
Publication Release Date: April 01, 2011
- 75 -
Revision C
9.5 16-Pin SOIC 300-mil (Package Code SF)
GAUGE PLANE
DETAIL A
GAUGE PLANE
DETAIL A
SYMBOL
MILLIMETERS
INCHES
Min
Nom
Max
Min
Nom
Max
A
2.36
2.49
2.64
0.093
0.098
0.104
A1
0.10
---
0.30
0.004
---
0.012
A2
---
2.31
---
0.091
---
b
0.33
0.41
0.51
0.013
0.016
0.020
C
0.18
0.23
0.28
0.007
0.009
0.011
D
10.08
10.31
10.49
0.397
0.406
0.413
E
10.01
10.31
10.64
0.394
0.406
0.419
E1
7.39
7.49
7.59
0.291
0.295
0.299
e
(2)
1.27 BSC.
0.050 BSC.
L
0.38
0.81
1.27
0.015
0.032
0.050
y
---
0.076
---
0.003
θ
---
---
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
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