参数资料
型号: W25Q16CVZPIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 16M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 6 X 5 MM, GREEN, WSON-8
文件页数: 25/79页
文件大小: 1131K
代理商: W25Q16CVZPIG
W25Q16CV
Publication Release Date: April 01, 2011
- 31 -
Revision C
7.2.14 Fast Read Dual I/O (BBh)
The Fast Read Dual I/O (BBh) instruction allows for improved random access while maintaining two IO
pins, IO0 and IO1. It is similar to the Fast Read Dual Output (3Bh) instruction but with the capability to input
the Address bits (A23-0) two bits per clock. This reduced instruction overhead may allow for code
execution (XIP) directly from the Dual SPI in some applications.
Fast Read Dual I/O with “Continuous Read Mode”
The Fast Read Dual I/O instruction can further reduce instruction overhead through setting the
“Continuous Read Mode” bits (M7-0) after the input Address bits (A23-0), as shown in Figure 13a. The
upper nibble of the (M7-4) controls the length of the next Fast Read Dual I/O instruction through the
inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M3-0) are don’t care
(“x”). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock.
If the “Continuous Read Mode” bits M5-4 = (1,0), then the next Fast Read Dual I/O instruction (after /CS is
raised and then lowered) does not require the BBh instruction code, as shown in Figure 13b. This reduces
the instruction sequence by eight clocks and allows the Read address to be immediately entered after /CS
is asserted low. If the “Continuous Read Mode” bits M5-4 do not equal to (1,0), the next instruction (after
/CS is raised and then lowered) requires the first byte instruction code, thus returning to normal operation.
A “Continuous Read Mode” Reset instruction can also be used to reset (M7-0) before issuing normal
instructions (See 7.2.20 for detail descriptions).
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (BBh)
8
9
10
12
13
14
24
25
26
27
28
29
30
31
6
4
2
0
*
23
/CS
CLK
DI
(IO
0)
DO
(IO
1)
0
32
33
34
35
36
37
38
39
7
5
3
1
*
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
**
IOs switch from
Input to Output
6
7
22
20
18
16
23
21
19
17
14
12
10
8
15
13
11
9
6
4
2
0
7
5
3
1
6
4
2
0
7
5
3
1
11
15
16
17
18
20
21
22
19
23
1
A23-16
A15-8
A7-0
M7-0
Byte 1
Byte 2
Byte 3
Byte 4
= MSB
*
Figure 13a. Fast Read Dual I/O Instruction Sequence (Initial instruction or previous M5-4
≠ 10)
相关PDF资料
PDF描述
W25Q16CVTCIP 16M X 1 SPI BUS SERIAL EEPROM, PBGA24
WF2M32S-100GTI 8M X 8 FLASH 5V PROM MODULE, 100 ns, CQFP68
WE128K8-200CQ 128K X 8 EEPROM 5V MODULE, 200 ns, CDIP32
WS512K32F-20H2C 2M X 8 MULTI DEVICE SRAM MODULE, 20 ns, CHMA66
WS512K32F-25G2TQA 2M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CQMA68
相关代理商/技术参数
参数描述
W25Q16CVZPIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16DVDAIG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16DVDAIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16DVDAIQ 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q16DVSFIG 制造商:Winbond Electronics Corp 功能描述:IC FLASH 16MBIT 104MHZ 16SOIC