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参数资料
| 型号： | W25Q32BVDAIG |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 32M X 1 SPI BUS SERIAL EEPROM, PDIP8 |
| 封装： | 0.300 INCH, GREEN, PLASTIC, DIP-8 |
| 文件页数： | 11/79页 |
| 文件大小： | 1090K |
| 代理商： | W25Q32BVDAIG |
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W25Q32BV
Publication Release Date: April 01, 2011
- 19 -
Revision F
7.2 INSTRUCTIONS
The instruction set of the W25Q32BV consists of thirty five basic instructions that are fully controlled
through the SPI bus (see Instruction Set table1-3). Instructions are initiated with the falling edge of Chip
Select (/CS). The first byte of data clocked into the DI input provides the instruction code. Data on the DI
input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in figures 4
through 37. All read instructions can be completed after any clocked bit. However, all instructions that
Write, Program or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been
clocked) otherwise the instruction will be ignored. This feature further protects the device from inadvertent
writes. Additionally, while the memory is being programmed or erased, or when the Status Register is
being written, all instructions except for Read Status Register will be ignored until the program or erase
cycle has completed.
7.2.1
Manufacturer and Device Identification
MANUFACTURER ID
(MF7-MF0)
Winbond Serial Flash
EFh
Device ID
(ID7-ID0)
(ID15-ID0)
Instruction
ABh, 90h
9Fh
W25Q32BV
15h
4016h
相关PDF资料 |
PDF描述 |
|---|---|
| W25Q32BVSFIG | 32M X 1 SPI BUS SERIAL EEPROM, PDSO16 |
| W3EG6466S335BD4S | 64M X 64 DDR DRAM MODULE, 0.7 ns, DMA200 |
| WEDF1M32B-70G2UC5A | 1M X 32 FLASH 5V PROM MODULE, 70 ns, CQFP68 |
| WE128K32P-140G2TI | 128K X 32 EEPROM 5V MODULE, 125 ns, CQFP68 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q32BVDAIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVSFAG | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVSFAP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q32BVSFIG | 功能描述:IC SPI FLASH 32MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.173"，4.40mm 宽） 供应商设备封装:8-MFP 包装:带卷 (TR) |
| W25Q32BVSFIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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