参数资料
型号: W25Q32BVDAIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 32M X 1 SPI BUS SERIAL EEPROM, PDIP8
封装: 0.300 INCH, GREEN, PLASTIC, DIP-8
文件页数: 64/79页
文件大小: 1090K
代理商: W25Q32BVDAIG
W25Q32BV
Publication Release Date: April 01, 2011
- 67 -
Revision F
8.6 AC Electrical Characteristics
DESCRIPTION
SYMBOL
ALT
SPEC
UNIT
MIN
TYP
MAX
Clock frequency for Single/Dual SPI instructions
except for Read Data instruction (03h)
3.0V-3.6V VCC & Industrial Temperature
FR1
fC1
D.C.
104
MHz
Clock frequency for all instructions
except for Read Data instruction (03h)
2.7V-3.6V VCC & Industrial Temperature
FR2
fC1
D.C.
80
MHz
Clock frequency for Read Data instruction (03h)
fR
D.C.
50
MHz
Clock High, Low Time except Read Data (03h)
tCLH,
tCLL(1)
4.5
ns
Clock High, Low Time
for Read Data (03h) instruction
tCRLH,
tCRLL(1)
6
ns
Clock Rise Time peak to peak
tCLCH(2)
0.1
V/ns
Clock Fall Time peak to peak
tCHCL(2)
0.1
V/ns
/CS Active Setup Time relative to CLK
tSLCH
tCSS
5
ns
/CS Not Active Hold Time relative to CLK
tCHSL
5
ns
Data In Setup Time
tDVCH
tDSU
1.5
ns
Data In Hold Time
tCHDX
tDH
4
ns
/CS Active Hold Time relative to CLK
tCHSH
5
ns
/CS Not Active Setup Time relative to CLK
tSHCH
5
ns
/CS Deselect Time (for Array Read
Array Read)
tSHSL1
tCSH
7
ns
/CS Deselect Time (for Erase or Program
Read
Status Registers)
Volatile Status Register Write Time
tSHSL2
tCSH
40
ns
Output Disable Time
tSHQZ(2)
tDIS
7
ns
Clock Low to Output Valid
2.7V-3.6V / 3.0V-3.6V
tCLQV1
tV1
6 / 5
ns
Clock Low to Output Valid (for Read ID instructions)
2.7V-3.6V / 3.0V-3.6V
tCLQV2
tV2
8.5 / 7.5
ns
Output Hold Time
tCLQX
tHO
0
ns
/HOLD Active Setup Time relative to CLK
tHLCH
5
ns
Continued – next page
相关PDF资料
PDF描述
W25Q32BVSFIG 32M X 1 SPI BUS SERIAL EEPROM, PDSO16
W3EG6466S335BD4S 64M X 64 DDR DRAM MODULE, 0.7 ns, DMA200
WEDF1M32B-70G2UC5A 1M X 32 FLASH 5V PROM MODULE, 70 ns, CQFP68
WE128K32P-140G2TI 128K X 32 EEPROM 5V MODULE, 125 ns, CQFP68
WE128K32P-150G2TQA 128K X 32 EEPROM 5V MODULE, 125 ns, CQFP68
相关代理商/技术参数
参数描述
W25Q32BVDAIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSFAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSFAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSFIG 功能描述:IC SPI FLASH 32MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.173",4.40mm 宽) 供应商设备封装:8-MFP 包装:带卷 (TR)
W25Q32BVSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI