参数资料
型号: W25Q32BVSSIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 32M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 0.208 INCH, GREEN, SOIC-8
文件页数: 1/79页
文件大小: 1090K
代理商: W25Q32BVSSIP
W25Q32BV
Publication Release Date: April 01, 2011
- 1 -
Revision F
3V 32M-BIT
SERIAL FLASH MEMORY WITH
DUAL AND QUAD SPI
相关PDF资料
PDF描述
W3EG6466S262AD4M 64M X 64 DDR DRAM MODULE, 0.75 ns, DMA200
WEDF1M32B-120H1C5A 1M X 32 FLASH 5V PROM MODULE, 120 ns, CPGA66
WEDF1M32B-120H1I5A 1M X 32 FLASH 5V PROM MODULE, 120 ns, CPGA66
WEDF1M32B-70G2UI5A 1M X 32 FLASH 5V PROM MODULE, 70 ns, CQFP68
WE128K32N-125G2TQA 128K X 32 EEPROM 5V MODULE, 125 ns, CQFP68
相关代理商/技术参数
参数描述
W25Q32BVTCAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVTCAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVTCIG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVTCIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVZEAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI