参数资料
型号: W25Q32BWZPIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 4M X 8 SPI BUS SERIAL EEPROM, DSO8
封装: 6 X 5 MM, GREEN, WSON-8
文件页数: 51/72页
文件大小: 2212K
代理商: W25Q32BWZPIP
W25Q32BW
Publication Release Date: July 08, 2010
- 55 -
Preliminary - Revision E
10.2.37 Program Security Registers (42h)
The Program Security Register instruction is similar to the Page Program instruction. It allows from one
byte to 256 bytes of security register data to be programmed at previously erased (FFh) memory
locations. A Write Enable instruction must be executed before the device will accept the Program Security
Register Instruction (Status Register bit WEL= 1). The instruction is initiated by driving the /CS pin low
then shifting the instruction code “42h” followed by a 24-bit address (A23-A0) and at least one data byte,
into the DI pin. The /CS pin must be held low for the entire length of the instruction while data is being
sent to the device.
ADDRESS
A23-16
A15-12
A11-8
A7-0
Security Register #0*
00h
0 0 0 0
Byte Address
Security Register #1
00h
0 0 0 1
0 0 0 0
Byte Address
Security Register #2
00h
0 0 1 0
0 0 0 0
Byte Address
Security Register #3
00h
0 0 1 1
0 0 0 0
Byte Address
* Please note that Security Register 0 is Reserved by Winbond for future use. It is recommended to use
Security registers 1- 3 before using register 0.
The Program Security Register instruction sequence is shown in figure 35. The Security Register Lock
Bits (LB3-0) in the Status Register-2 can be used to OTP protect the security registers. Once a lock bit is
set to 1, the corresponding security register will be permanently locked, Program Security Register
instruction to that register will be ignored (See 10.1.9, 10.2.20 for detail descriptions).
Figure 35. Program Security Registers Instruction Sequence
Instruction (42h)
相关PDF资料
PDF描述
W949D2CBJX5E 16M X 32 DDR DRAM, 5 ns, PBGA90
WF128K32N-150HC5 512K X 8 FLASH 5V PROM MODULE, 150 ns, HIP66
WPS512K8LB-85GM 512K X 8 STANDARD SRAM, 85 ns, PDSO32
WPS128K32GV-17PJI 512K X 8 MULTI DEVICE SRAM MODULE, 17 ns, PQMA68
WF2M32B-150HM5 8M X 8 FLASH 5V PROM MODULE, 150 ns, CHIP66
相关代理商/技术参数
参数描述
W25Q32DW 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32DWSFIG 功能描述:IC FLASH SPI 32MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q32DWSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32DWSSIG 功能描述:IC FLASH SPI 32MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q32DWSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI