参数资料
| 型号： | W25Q32DWSSIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 3/82页 |
| 文件大小： | 0K |
| 描述： | IC FLASH SPI 32MBIT 8SOIC |
| 标准包装： | 90 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 32M（4M x 8） |
| 速度： | 104MHz |
| 接口： | SPI 串行 |
| 电源电压： | 1.7 V ~ 1.95 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
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W25Q32DW
10.2
INSTRUCTIONS................................................................................................................. 18
10.2.1
10.2.2
10.2.3
10.2.4
10.2.5
10.2.6
10.2.7
10.2.8
10.2.9
10.2.10
10.2.11
10.2.12
10.2.13
10.2.14
10.2.15
10.2.16
10.2.17
10.2.18
10.2.19
10.2.20
10.2.21
10.2.22
10.2.23
10.2.24
10.2.25
10.2.26
10.2.27
10.2.28
10.2.29
10.2.30
10.2.31
10.2.32
10.2.33
10.2.34
10.2.35
10.2.36
10.2.37
10.2.38
10.2.39
10.2.40
Manufacturer and Device Identification .............................................................................. 18
Instruction Set Table 1 (Standard SPI Instructions) ........................................................... 19
Instruction Set Table 2 (Dual SPI Instructions) ................................................................... 20
Instruction Set Table 3 (Quad SPI Instructions) ................................................................. 20
Instruction Set Table 4 (QPI Instructions) ........................................................................... 21
Write Enable (06h) ............................................................................................................. 23
Write Enable for Volatile Status Register (50h) .................................................................. 23
Write Disable (04h)............................................................................................................. 24
Read Status Register-1 (05h) and Read Status Register-2 (35h) ...................................... 24
Write Status Register (01h) .............................................................................................. 25
Read Data (03h) ............................................................................................................... 27
Fast Read (0Bh) ............................................................................................................... 28
Fast Read Dual Output (3Bh) ........................................................................................... 30
Fast Read Quad Output (6Bh) .......................................................................................... 31
Fast Read Dual I/O (BBh) ................................................................................................. 32
Fast Read Quad I/O (EBh) ............................................................................................... 34
Word Read Quad I/O (E7h) .............................................................................................. 37
Octal Word Read Quad I/O (E3h)..................................................................................... 39
Set Burst with Wrap (77h) ................................................................................................ 41
Page Program (02h) ......................................................................................................... 42
Quad Input Page Program (32h) ...................................................................................... 44
Sector Erase (20h) ........................................................................................................... 44
32KB Block Erase (52h) ................................................................................................... 46
64KB Block Erase (D8h) ................................................................................................... 47
Chip Erase (C7h / 60h) ..................................................................................................... 48
Erase / Program Suspend (75h) ....................................................................................... 49
Erase / Program Resume (7Ah) ....................................................................................... 51
Power-down (B9h) ............................................................................................................ 52
Release Power-down / Device ID (ABh) ........................................................................... 53
Read Manufacturer / Device ID (90h) ............................................................................... 55
Read Manufacturer / Device ID Dual I/O (92h) ................................................................. 56
Read Manufacturer / Device ID Quad I/O (94h) ............................................................... 57
Read Unique ID Number (4Bh)......................................................................................... 58
Read JEDEC ID (9Fh) ...................................................................................................... 59
Erase Security Registers (44h) ......................................................................................... 60
Program Security Registers (42h) .................................................................................... 61
Read Security Registers (48h) ......................................................................................... 62
Set Read Parameters (C0h) ............................................................................................. 63
Burst Read with Wrap (0Ch)............................................................................................. 64
Enable QPI (38h) .............................................................................................................. 65
Publication Release Date: September 18, 2012
-3-
Revision D
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q32DWSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q32DWZEIG | 功能描述:IC FLASH SPI 32MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP（0.465"，11.8mm 宽） 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8 |
| W25Q32DWZEIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 32MBIT 104MHZ 8WSON |
| W25Q32DWZEIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q32DWZPIG | 功能描述:IC FLASH SPI 32MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
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