参数资料
型号: W25Q32DWSSIG
厂商: Winbond Electronics
文件页数: 57/82页
文件大小: 0K
描述: IC FLASH SPI 32MBIT 8SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 32M(4M x 8)
速度: 104MHz
接口: SPI 串行
电源电压: 1.7 V ~ 1.95 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
W25Q32DW
10.2.32 Read Manufacturer / Device ID Quad I/O (94h)
The Read Manufacturer / Device ID Quad I/O instruction is an alternative to the Read Manufacturer /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID
at 4x speed.
The Read Manufacturer / Device ID Quad I/O instruction is similar to the Fast Read Quad I/O instruction.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “94h” followed by a
four clock dummy cycles and then a 24-bit address (A23-A0) of 000000h, but with the capability to input
the Address bits four bits per clock. After which, the Manufacturer ID for Winbond (EFh) and the Device ID
are shifted out four bits per clock on the falling edge of CLK with most significant bit (MSB) first as shown
in Figure 31. The Device ID values for the W25Q32DW is listed in Manufacturer and Device Identification
table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to
the other. The instruction is completed by driving /CS high.
/CS
Mode 3
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
CLK
Mode 0
Instruction (94h)
A23-16
A15-8
A7-0
(00h)
M7-0
Dummy
Dummy
IOs switch from
Input to Output
IO 0
4
0
4
0
4
0
4
0
4
0
4
0
IO 1
IO 2
IO 3
High Impedance
High Impedance
High Impedance
5
6
7
1
2
3
5
6
7
1
2
3
5
6
7
1
2
3
5
6
7
1
2
3
5
6
7
1
2
3
5
6
7
1
2
3
/CS
MFR ID
Device ID
23
24
25
26
27
28
29
30
Mode 3
CLK
Mode 0
IO 0
IO 1
IO 2
IO 3
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
MFR ID
(repeat)
Device ID
(repeat)
MFR ID
(repeat)
Device ID
(repeat)
Figure 31. Read Manufacturer / Device ID Quad I/O Instruction (SPI Mode only)
Note:
The “Continuous Read Mode” bits M(7-0) must be set to Fxh to be compatible with Fast Read Quad I/O instruction.
Publication Release Date: September 18, 2012
- 57 -
Revision D
相关PDF资料
PDF描述
RMA50DRSD-S273 CONN EDGECARD 100PS DIP .125 SLD
AMC28DRXI-S734 CONN EDGECARD 56POS DIP .100 SLD
RCB90DHBN CONN EDGECARD 180PS R/A .050 DIP
M1A3PE3000L-PQG208 IC FPGA 1KB FLASH 3M 208-PQFP
RCB90DHBD CONN EDGECARD 180PS R/A .050 DIP
相关代理商/技术参数
参数描述
W25Q32DWSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32DWZEIG 功能描述:IC FLASH SPI 32MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP(0.465",11.8mm 宽) 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8
W25Q32DWZEIG TR 制造商:Winbond Electronics Corp 功能描述:IC FLASH 32MBIT 104MHZ 8WSON
W25Q32DWZEIP 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q32DWZPIG 功能描述:IC FLASH SPI 32MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)