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参数资料
| 型号： | W25Q64CVZEIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 79/80页 |
| 文件大小： | 0K |
| 描述： | IC SPI FLASH 64MBIT 8WSON |
| 标准包装： | 63 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 64M（8M x 8） |
| 速度： | 80MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-WDFN 裸露焊盘 |
| 供应商设备封装： | 8-WSON（8x6） |
| 包装： | 管件 |
| 其它名称： | Q6830520 1 |
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W25Q64CV
Revision history
VERSION
A
B
DATE
01/04/10
07/08/10
PAGE
17
69-74
64, 67
62, 66
5, 10, 21, 56-58
5, 75 & 76
DESCRIPTION
New Create Preliminary
Updated memory protection table
Updated Package diagrams
Updated parameter VIL/VIH, Icc, tSE
Updated F R Frequencies
Added SFDP feature
Added automotive temperature
Added TFBGA package
Updated diagrams
9, 76-78, 23-69, 47,
Added /WP timing diagram
C
04/01/11
63
58-60
Updated Suspend description
Updated SFDP to JEDEC 1.0
Updated maximum VCC
Removed preliminary designator
D
E
F
G
07/11/11
09/23/11
05/07/12
10/09/13
57, 58
67
9, 76, 78-79
57
63
68
6, 69, 77-78
61, 77-79
61
77-78
Updated SFDP spec title to JESD216
Updated tCLH/tCLL
Added 5x5 ball array TFBGA package
Referred to SFDP definition application note
Updated ICC1
Updated notes for SOIC 208mil
Added VSOP 208mil package
Updated operating temperature grades
Removed automotive,industrial plus grade &
W25Q64CVxxIP
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Furthermore, Winbond products are not intended for
applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur. Winbond customers using or
selling these products for use in such applications do so at their own risk and agree to fully indemnify
Winbond for any damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document
and the products and services described herein at any time, without notice.
Publication Release Date: May 07, 2012
- 79 -
Revision F
相关PDF资料 |
PDF描述 |
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| W25Q64DWZEIG | IC FLASH SPI 64MBIT 8WSON |
| W25Q64FVSFIG | IC SPI FLASH 64MBIT 16SOIC |
| W25Q80BVSNIG | IC SPI FLASH 8MBIT 8SOIC |
| W25Q80BWSSIG | IC FLASH SPI 8MBIT 8SOIC |
| W25X40BVZPIG | IC SPI FLASH 4MBIT 8WSON |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q64CVZEIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVZPAG | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVZPAP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVZPIG | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CVZPIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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