参数资料
型号: W25X80AVDAIZ
厂商: Winbond Electronics
文件页数: 3/45页
文件大小: 0K
描述: IC FLASH 16MBIT 100MHZ 8DIP
标准包装: 60
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 8M(1M x 8)
速度: 100MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-DIP(0.300",7.62mm)
供应商设备封装: 8-PDIP
包装: 管件
W25X10A, W25X20A, W25X40A, W25X80A
10.2.7
10.2.8
10.2.9
10.2.10
10.2.11
10.2.12
10.2.13
10.2.14
10.2.15
10.2.16
10.2.17
Read Data (03h) ...........................................................................................................19
Fast Read (0Bh) ...........................................................................................................20
Fast Read Dual Output (3Bh) .......................................................................................21
Page Program (02h) ...................................................................................................22
Sector Erase (20h) .....................................................................................................23
Block Erase (D8h) ......................................................................................................24
Chip Erase (C7h or 60h) .............................................................................................25
Power-down (B9h) ......................................................................................................26
Release Power-down / Device ID (ABh) .....................................................................27
Read Manufacturer / Device ID (90h) .........................................................................29
JEDEC ID (9Fh) .........................................................................................................30
11.
ELECTRICAL CHARACTERISTICS ......................................................................................... 31
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
Absolute Maximum Ratings .......................................................................................... 31
Operating Ranges ......................................................................................................... 31
Power-up Timing and Write Inhibit Threshold .............................................................. 31
DC Electrical Characteristics ........................................................................................ 33
AC Measurement Conditions ........................................................................................ 34
AC Electrical Characteristics ........................................................................................ 35
AC Electrical Characteristics (cont’d) ........................................................................... 36
Serial Output Timing ..................................................................................................... 37
Input Timing .................................................................................................................. 37
Hold Timing ................................................................................................................. 37
12.
PACKAGE SPECIFICATION .................................................................................................... 38
12.1
12.2
12.3
12.4
8-Pin SOIC 150-mil (Package Code SN) ...................................................................... 38
8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 39
8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40
8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 41
8-Pad WSON 6x5mm Cont’d. ................................................................................................... 42
13.
ORDERING INFORMATION .................................................................................................... 43
13.1
Valid Part Numbers and Top Side Marking .................................................................. 44
14.
REVISION HISTORY ................................................................................................................ 45
Publication Release Date: August 7, 2009
-3-
Revision F
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