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参数资料
| 型号： | W332M64V-125SBI |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | DRAM |
| 英文描述： | 32M X 64 SYNCHRONOUS DRAM, 6 ns, PBGA208 |
| 封装： | 13 X 22 MM, PLASTIC, BGA-208 |
| 文件页数： | 7/15页 |
| 文件大小： | 355K |
| 代理商： | W332M64V-125SBI |
15
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W332M64V-XSBX
August 2007
Rev. 4
Document Title
32M x 64 SDRAM Multi-Chip Package, 13mm x 22mm
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
October 2004
Advanced
Rev 1
Changes (Pg. 1, 9, 13, 15)
1.1 Change status to Preliminary
1.2 PNC#04019 – Change max thickness of package body to
2.56mm
1.3 Change max storage temperature to 125°C
1.4 Change typical weight to 1.5g
1.5 Add thermal resistance values
May 2005
Preliminary
Rev. 2
Rev.3
Rev.4
Changes (Pg. 1, 10, 15)
2.1 Update input leakage address current
2.2 Update ICC1, ICC3, ICC4 and ICC7
Changes (Pg. 1-15)
3.1 Change status to Final
3.2 Add 133MHz operation charcteristics
Changes (Pg. 1, 13, 15)
4.1 Update package thickness to 2.27mm
August 2005
September 2005
August 2007
Preliminary
Final
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W332M64V-125SBM | 制造商:Microsemi Corporation 功能描述:32M X 64 SDRAM, 3.3V, 125MHZ, 208 PBGA, MIL-TEMP. - Bulk |
| W332M64V-133BC | 制造商:Microsemi Corporation 功能描述:32M X 64 SDRAM, 3.3V, 133MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W332M64V-133BI | 制造商:Microsemi Corporation 功能描述:32M X 64 SDRAM, 3.3V, 133MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W332M64V-133BM | 制造商:Microsemi Corporation 功能描述:32M X 64 SDRAM, 3.3V, 133MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W332M64V-133SBC | 制造商:Microsemi Corporation 功能描述:32M X 64 SDRAM, 3.3V, 133MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk |
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