参数资料
型号: W332M72V-133BM
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: DRAM
英文描述: 32M X 72 SYNCHRONOUS DRAM, 5.5 ns, PBGA219
封装: 32 X 25 MM, PLASTIC, BGA-219
文件页数: 5/15页
文件大小: 257K
代理商: W332M72V-133BM
13
White Electronic Designs
W332M72V-XBX
March 2006
Rev. 3
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
PACKAGE DIMENSION: 219 PLASTIC BALL GRID ARRAY (PBGA)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
BOTTOM VIEW
32.1 (1.264) MAX
1 2 3 4 5 6 7 8 9 10 11121314 1516
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
25.1 (0.988)
MAX
19.05 (0.750)
NOM
1.27 (0.050)
NOM
19.05 (0.750) NOM
2.03 (0.080)
MAX
0.61
(0.024)
NOM
219 x 0.762 (0.030) NOM
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参数描述
W332M72V-133SBC 制造商:Microsemi Corporation 功能描述:32M X 72 SDRAM, 3.3V, 133MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk
W332M72V-133SBI 制造商:Microsemi Corporation 功能描述:32M X 72 SDRAM, 3.3V, 133MHZ, 208 PBGA, INDUSTRIAL TEMP. - Bulk
W332M72V-133SBM 制造商:Microsemi Corporation 功能描述:32M X 72 SDRAM, 3.3V, 133MHZ, 208 PBGA, MIL-TEMP. - Bulk
W332M72V-XBX 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32Mx72 Synchronous DRAM
W332M72V-XSBX 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32Mx72 Synchronous DRAM