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参数资料
| 型号： | W3E32M64S-400SBC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | DRAM |
| 英文描述： | 32M X 64 DDR DRAM, 0.7 ns, PBGA208 |
| 封装： | 13 X 22 MM, PLASTIC, BGA-208 |
| 文件页数： | 8/17页 |
| 文件大小： | 615K |
| 代理商： | W3E32M64S-400SBC |
16
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W3E32M64S-XSBX
November 2005
Rev. 3
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR SDRAM
CONFIGURATION, 32M x 64
2.5V Power Supply
DATA RATE (Mbs)
200 = 200Mbs
250 = 250Mbs
266 = 266Mbs
333 = 333Mbs*
400 = 400Mbs**
PACKAGE:
SB = 208 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial 0°C to +70°C
W 3E 32M 64 S - XXX SB X
*
For 333Mbs operation of Industrial temperature CL = 2.5, at Military temperature CL = 3.
* This product is subject to change without notice.
** For 400Mbs operation at commercial or industrial temperature CL = 3.
*This product is under development, is not qualied or characterized and is subject to change or cancellation without notice.
相关PDF资料 |
PDF描述 |
|---|---|
| W3E32M64SA-200BC | 32M X 64 DDR DRAM, 0.8 ns, PBGA219 |
| W3E32M64SA-333BC | 32M X 64 DDR DRAM, 0.7 ns, PBGA219 |
| W3E32M64SA-333BM | 32M X 64 DDR DRAM, 0.7 ns, PBGA219 |
| W3E32M64SA-333BI | 32M X 64 DDR DRAM, 0.7 ns, PBGA219 |
| W3E32M72S-200SBM | 32M X 72 DDR DRAM, 0.8 ns, PBGA208 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W3E32M64SA-200BC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64SA-200BI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M64SA-200BM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M64SA-250BC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64SA-250BI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
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