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参数资料
| 型号： | W3E32M64SA-200BI |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | DRAM |
| 英文描述： | 32M X 64 DDR DRAM, 0.8 ns, PBGA219 |
| 封装： | 25 X 25 MM, PLASTIC, BGA-219 |
| 文件页数： | 9/17页 |
| 文件大小： | 701K |
| 代理商： | W3E32M64SA-200BI |
W3E32M64SA-XBX
17
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
December 2007
Rev. 1
Document Title
32M x 64 DDR SDRAM Multi-Chip Package, 219 PBGA,
Direct pinout upgrade from 16M x 64 DDR
Revision History
Rev # History
Release Date Status
Rev 0
Initial Release
October 2007
Final
Rev 1
Changes (Pg. 1, 16, 17)
1.1 Update package thickness to 2.08mm Max
December 2007
Final
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W3E32M64SA-200BM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M64SA-250BC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64SA-250BI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M64SA-250BM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M64SA-266BC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 266 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
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