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参数资料
| 型号： | W3E64M72S-200SBC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | DRAM |
| 英文描述： | 64M X 72 DDR DRAM, 0.8 ns, PBGA219 |
| 封装： | 25 X 32 MM, PLASTIC, BGA-219 |
| 文件页数： | 15/19页 |
| 文件大小： | 496K |
| 代理商： | W3E64M72S-200SBC |
W3E64M72S-XSBX
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
September 2007
Rev. 3
White Electronic Designs Corp. reserves the right to change products or specications without notice.
INITIALIZATION
DDR SDRAMs must be powered up and initialized in a
predened manner. Operational procedures other than
those specied may result in undened operation. Power
must rst be applied to VCC and VCCQ simultaneously, and
then to VREF (and to the system VTT). VTT must be applied
after VCCQ to avoid device latch-up, which may cause
permanent damage to the device. VREF can be applied any
time after VCCQ but is expected to be nominally coincident
with VTT. Except for CKE, inputs are not recognized as
valid until after VREF is applied. CKE is an SSTL_2
input but will detect an LVCMOS LOW level after VCC is
applied. After CKE passes through VIH, it will transition to
an SSTL_2 signal and remain as such until power is cycled.
Maintaining an LVCMOS LOW level on CKE during power-
up is required to ensure that the DQ and DQS outputs will
be in the High-Z state, where they will remain until driven
in normal operation (by a read access). After all power
supply and reference voltages are stable, and the clock
is stable, the DDR SDRAM requires a 200μs delay prior
to applying an executable command.
Once the 200μs delay has been satised, a DESELECT
or NOP command should be applied, and CKE should
be brought HIGH. Following the NOP command, a
PRECHARGE ALL command should be applied. Next a
LOAD MODE REGISTER command should be issued for
the extended mode register (BA1 LOW and BA0 HIGH)
to enable the DLL, followed by another LOAD MODE
REGISTER command to the mode register (BA0/BA1
both LOW) to reset the DLL and to program the operating
parameters. Two-hundred clock cycles are required
between the DLL reset and any READ command. A
PRECHARGE ALL command should then be applied,
placing the device in the all banks idle state.
Once in the idle state, two AUTO REFRESH cycles must
be performed (tRFC must be satised.) Additionally, a LOAD
MODE REGISTER command for the mode register with
the reset DLL bit deactivated (i.e., to program operating
parameters without resetting the DLL) is required.
Following these requirements, the DDR SDRAM is ready
for normal operation.
REGISTER DEFINITION
MODE REGISTER
The Mode Register is used to dene the specic mode of
operation of the DDR SDRAM. This denition includes the
selection of a burst length, a burst type, a CAS latency,
and an operating mode, as shown in Figure 3. The Mode
Register is programmed via the MODE REGISTER SET
command (with BA0 = 0 and BA1 = 0) and will retain
the stored information until it is programmed again or
the device loses power. (Except for bit A8 which is self
clearing).
Reprogramming the mode register will not alter the contents
of the memory, provided it is performed correctly. The Mode
Register must be loaded (reloaded) when all banks are
idle and no bursts are in progress, and the controller must
wait the specied time before initiating the subsequent
operation. Violating either of these requirements will result
in unspecied operation.
Mode register bits A0-A2 specify the burst length, A3
species the type of burst (sequential or interleaved),
A4-A6 specify the CAS latency, and A7-A12 specify the
operating mode.
BURST LENGTH
Read and write accesses to the DDR SDRAM are burst
oriented, with the burst length being programmable,
as shown in Figure 3. The burst length determines
the maximum number of column locations that can be
accessed for a given READ or WRITE command. Burst
lengths of 2, 4 or 8 locations are available for both the
sequential and the interleaved burst types.
Reserved states should not be used, as unknown operation
or incompatibility with future versions may result.
When a READ or WRITE command is issued, a block of
columns equal to the burst length is effectively selected.
All accesses for that burst take place within this block,
meaning that the burst will wrap within the block if a
boundary is reached. The block is uniquely selected by
A1-Ai when the burst length is set to two; by A2-Ai when the
burst length is set to four (where Ai is the most signicant
column address for a given conguration); and by A3-Ai
when the burst length is set to eight. The remaining (least
signicant) address bit(s) is (are) used to select the starting
location within the block. The programmed burst length
applies to both READ and WRITE bursts.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W3E64M72S-200SBI | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR, 2.5V, 200 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E64M72S-200SBM | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR, 2.5V, 200 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E64M72S-250BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx72 DDR SDRAM |
| W3E64M72S-250BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx72 DDR SDRAM |
| W3E64M72S-250BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx72 DDR SDRAM |
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