参数资料
型号: W3H32M64E-667SBC
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: DRAM
英文描述: 32M X 64 DDR DRAM, 0.65 ns, PBGA208
封装: 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
文件页数: 20/30页
文件大小: 958K
代理商: W3H32M64E-667SBC
W3H32M64E-XSBX
27
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
September 2009
Rev. 11
White Electronic Designs Corp. reserves the right to change products or specications without notice.
All linear dimensions are millimeters and parenthetically in inches
BOTTOM VIEW
FIGURE 14 – PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
11 10
9
8
7
6
5
4
3
2
1
208 x 0.60 (0.024) NOM
1.0 (0.039)NOM
10.0 (0.394) NOM
16.15 (0.636) MAX
20.15
(0.793)
MAX
18.0
(0.709)
NOM
1.0
(0.039)
NOM
2.56 (0.100) MAX
0.50
(0.020)
NOM
相关PDF资料
PDF描述
W3H32M64EA-400SBC 32M X 64 DDR DRAM, PBGA208
W3H32M64EA-667SBM 32M X 64 DDR DRAM, PBGA208
W3H32M64EA-667SBC 32M X 64 DDR DRAM, PBGA208
W3H32M72E-667SB2M 32M X 72 DDR DRAM, 0.65 ns, PBGA208
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相关代理商/技术参数
参数描述
W3H32M64E-667SBI 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Trays 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY
W3H32M64E-667SBM 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 667MHZ, 208PBGA MIL-TEMP. - Bulk
W3H32M64EA-400SBM 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY
W3H32M64E-ES 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESC 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package