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参数资料
| 型号： | W3H32M64E-667SBC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | DRAM |
| 英文描述： | 32M X 64 DDR DRAM, 0.65 ns, PBGA208 |
| 封装： | 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
| 文件页数： | 24/30页 |
| 文件大小： | 958K |
| 代理商： | W3H32M64E-667SBC |
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W3H32M64E-XSBX
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
September 2009
Rev. 11
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History Continued
Rev #
History
Release Date
Status
Rev 7
Changes (Pg. 1)
7.1 Remove "user congurable as 2 x 32M x 32".
June 2009
Final
Rev 8
Changes (Pg. 25)
8.1 AC Timing Parameters:(667Mbs and 533Mbs) change
tAC(max): +650ps, tAC(min): -550ps, tDQSCK(max): +650ps,
tDQSCK(min): -550ps, tDH: +500ps.
July 2009
Final
Rev 9
Changes (Pg. 1, 2)
9.1 Add "user congurable as 2 x 32M x 32"; rescind Rev 7.
9.2 Change functional block diagram back to reect; WEB#,
RASB#, CASB#, CSB#.
August 2009
Final
Rev 10
Changes (Pg. 2, 3)
10.1 Change functional block diagram back to reect; WEA#,
RASA#, CASA#, CSA#.
10.2 Change pinout on page 3 to reect the changes to WEA#,
WEB#, CASA#, CASB#, RASA#, RASB#, CSA# and
CSB#.
August 2009
Final
Rev 11
Changes (Pg. 1, 3, 4, 5, 25, 26, 27)
11.1 Remove * on 667 data rate, delete"This product is subject
to change without notice."
11.2 Change drawing in Fig. 1 to 32M64.
11.3 Change ball E5 to DNU**.
11.4 Change Table 1: CKEA, CKEB, CSA#, RASA#, WEA#,
and RASB#, CASB# WEB#.
11. 5 Remove core from VCCQ, Remove row address bits from
DNU.
11.6 Change length to 0.793 in. (MAX)
11.7 Change tREFI to 1.95 for Military Temperature in all speeds
September 2009
Final
相关PDF资料 |
PDF描述 |
|---|---|
| W3H32M64EA-400SBC | 32M X 64 DDR DRAM, PBGA208 |
| W3H32M64EA-667SBM | 32M X 64 DDR DRAM, PBGA208 |
| W3H32M64EA-667SBC | 32M X 64 DDR DRAM, PBGA208 |
| W3H32M72E-667SB2M | 32M X 72 DDR DRAM, 0.65 ns, PBGA208 |
| W3H32M72E-667SBC | 32M X 72 DDR DRAM, 0.65 ns, PBGA208 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W3H32M64E-667SBI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Trays 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
| W3H32M64E-667SBM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 667MHZ, 208PBGA MIL-TEMP. - Bulk |
| W3H32M64EA-400SBM | 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
| W3H32M64E-ES | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-ESC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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