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参数资料
| 型号： | W49F002U70BN |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 256K X 8 FLASH 5V PROM, 70 ns, PDIP32 |
| 封装： | PLASTIC, DIP-32 |
| 文件页数： | 18/30页 |
| 文件大小： | 0K |
| 代理商： | W49F002U70BN |
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W49F002U
Publication Release Date: April 19, 2005
- 25 -
Revision A7
12. ORDERING INFORMATION
PART NO.
ACCES
S TIME
(nS)
POWER
SUPPLY
CURRENT
MAX. (mA)
STANDBY
VDD
CURRENT
MAX. (
A)
PACKAGE
CYCLE
HARDWARE
SID READ
FUNCTION
W49F002U-70B
70
50
100 (CMOS) 32-pin DIP
10K
Y
W49F002U-90B
90
50
100 (CMOS) 32-pin DIP
10K
Y
W49F002U-12B
120
50
100 (CMOS) 32-pin DIP
10K
Y
W49F002UT70B
70
50
100 (CMOS) 32-pin TSOP (8 mm
× 20 mm)
10K
Y
W49F002UT90B
90
50
100 (CMOS) 32-pin TSOP (8 mm
× 20 mm)
10K
Y
W49F002UT12B
120
50
100 (CMOS) 32-pin TSOP (8 mm
× 20 mm)
10K
Y
W49F002UP70B
70
50
100 (CMOS) 32-pin PLCC
10K
Y
W49F002UP90B
90
50
100 (CMOS) 32-pin PLCC
10K
Y
W49F002UP12B
120
50
100 (CMOS) 32-pin PLCC
10K
Y
W49F002UQ70B
70
50
100 (CMOS) 32-pin STSOP (8 mm
× 14 mm)
10K
Y
W49F002UQ90B
90
50
100 (CMOS) 32-pin STSOP (8 mm
× 14 mm)
10K
Y
W49F002UQ12B
120
50
100 (CMOS) 32-pin STSOP (8 mm
× 14 mm)
10K
Y
W49F002U70BN
70
50
100 (CMOS) 32-pin DIP
10K
N
W49F002U90BN
90
50
100 (CMOS) 32-pin DIP
10K
N
W49F002U12BN
120
50
100 (CMOS) 32-pin DIP
10K
N
W49F002UT70N
70
50
100 (CMOS) 32-pin TSOP (8 mm
× 20 mm)
10K
N
W49F002UT90N
90
50
100 (CMOS) 32-pin TSOP (8 mm
× 20 mm)
10K
N
W49F002UT12N
120
50
100 (CMOS) 32-pin TSOP (8 mm
× 20 mm)
10K
N
W49F002UP70N
70
50
100 (CMOS) 32-pin PLCC
10K
N
W49F002UP90N
90
50
100 (CMOS) 32-pin PLCC
10K
N
W49F002UP12N
120
50
100 (CMOS) 32-pin PLCC
10K
N
W49F002UQ70N
70
50
100 (CMOS) 32-pin STSOP (8 mm
× 14 mm)
10K
N
W49F002UQ90N
90
50
100 (CMOS) 32-pin STSOP (8 mm
× 14 mm)
10K
N
W49F002UQ12N
120
50
100 (CMOS) 32-pin STSOP (8 mm
× 14 mm)
10K
N
W49F002UP12Z
120
50
100 (CMOS) 32-pin PLCC Lead free
10K
Y
Notes:
1. Winbond reserves the right to make changes to its products without prior notice.
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in
applications where personal injury might occur as a consequence of product failure.
3. Winbond offers Top Boot Block device, if any of Bottom Boot Block devices is required, please contact Winbond FAEs.
4. In Hardware SID read function column: Y = with SID read function; N = without SID read function.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W49F002U-90B | 制造商:WINBOND 制造商全称:Winbond 功能描述:256K X 8 CMOS FLASH MEMORY |
| W49F002UP12B | 制造商:WINBOND 制造商全称:Winbond 功能描述:256K X 8 CMOS FLASH MEMORY |
| W49F002UP70B | 制造商:WINBOND 制造商全称:Winbond 功能描述:256K X 8 CMOS FLASH MEMORY |
| W49F002UP90B | 制造商:WINBOND 制造商全称:Winbond 功能描述:256K X 8 CMOS FLASH MEMORY |
| W49F002UT12B | 制造商:WINBOND 制造商全称:Winbond 功能描述:256K X 8 CMOS FLASH MEMORY |
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