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参数资料
| 型号： | W671310P |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | 模拟传输电路 |
| 英文描述： | TELECOM-SLIC, PQCC28 |
| 封装： | PLASTIC, LCC-28 |
| 文件页数： | 30/48页 |
| 文件大小： | 1344K |
| 代理商： | W671310P |
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W671300 SERIES
9.3. THERMAL INFORMATION
Condition
Value
Thermal Resistance (Typical)
PLCC
[1]
QFN
[2]
ΘJA (°C/W)
ΘJC (°C/W)
53
N/A
26
1
Maximum Junction Temperature Plastic
150°C
Maximum Storage Temperature Range
-65°C to 150°C
Maximum Lead Temperature (Soldering 10s)
(PLCC – Lead Tips Only)
300°C
Notes:
[1] θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
[2] θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct
attach” features .
θJC, the “case temp” is measured at the center of the exposed metal pad on the package underside.
9.4. DIE CHARACTERISTICS
Condition
Value
Substrate Potential
VBH
Process
Bipolar-DI
CAUTION:
Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only
rating and operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
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